Residual stress distribution in machined hot pressed silicon nitride
Machining of hot pressed Si(3)N(4) causes high residual surface stresses, which can influence the mechanical behaviour of the finished ceramic component. To quantify this effect for normal machining practice, the distribution of induced stress within the near-surface layers of a hot pressed silicon nitride, machined by pendular grinding, has been studied using an X-ray diffraction technique. The decrease in stress magnitude with depth appears to follow a power law relationship. X-ray stress values were confirmed by the measurement of stresses by the bending of thin ceramic foils machined on one side. A simple mathemetical model is proposed to interpret the decrease in stress levels with depth.
Bibliographic Reference: Article: Journal of the American Ceramics Society (1995)
Record Number: 199511055 / Last updated on: 1995-08-18
Original language: en
Available languages: en