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The increase of the electrical resistivity in copper materials and in gold during irradiation with 1.85 MeV electrons below the temperature corresponding to the stage III recovery region is determined. From the analysis of these data by means of rate equations, the variations of the concentrations of interstitials, vacancies and agglomerates of interstitials as a function of the irradiation time and of the irradiation temperature are determined. The number of replacement collision sequences of dynamic crowdions is about N = 4 x 1.0 E4 before they convert into stable interstitials in well annealed pure copper, in commercial copper, and in pure gold. This number decreases with beryllium additions and is about N = 15 in copper doped with 763 ppm beryllium. The rate of spontaneous annihilation of vacancies with dynamic crowdions during irradiation depends on the number of replacement collisions and the production rate is considerably decreased in pure materials with respect to the initial radiation damage rate.

Additional information

Authors: GILHAUS H, JRC Ispra (IT);SCHÜLE W, JRC Ispra (IT)
Bibliographic Reference: Article: Radiation Effects and Defects in Solids
Record Number: 199511138 / Last updated on: 1995-08-23
Original language: en
Available languages: en