Joining of silicon nitride using Au/NiCr and Cu/NiCr interlayers
Joining of silicon nitride to silicon nitride with microdesigned Au/NiCr/Au and Cu/NiCr/Cu interlayers has been investigated. The influence of different bonding parameters, such as time, temperature and atmosphere, on the joint microstructure and strength has been studied. The microstructures and compositions of the ceramic-metal interfaces were examined in detail using optical microscopy, scanning electron microscopy (SEM) and electron probe microanalysis (EPMA) techniques; room and high temperature joining strengths were determined using four-point bending tests. The reactive bonding mechanism is considered using the available thermodynamic data for the systems studied, and the applicability of these for partial transient liquid phase bonding (PTLPB) is discussed.
Bibliographic Reference: Paper presented: The 4th European Conference on Advanced Materials and Processes, Padua (IT), September 25-28, 1995
Availability: Available from (1) as paper EN 39369 ORA
Record Number: 199511541 / Last updated on: 1995-12-12
Original language: en
Available languages: en