Application of the partial transient liquid phase bonding method for joining silicon nitride ceramics
Silicon nitride ceramics have been joined using the partial transient liquid phase bonding (PTLPB) process using Au/Ni-20Cr multilayer interlayers. The microstructure and chemical compositions of the joint interface have been characterised. Joints with room temperature (RT) maximum strengths of 698 MPa, corresponding to around 97% of the flexural strength of the monolithic ceramic were produced with bonding conditions that involved a 4 hour hold at a temperature of 1000 C. High temperature mechanical tests were also performed in a temperature range between 400 and 800 C in air. The results indicated that even at the highest testing temperature 25% of the RT joint strength has been retained. Moreover, the standard deviation in strength decreases, yielding joints with reproducible strengths.
Bibliographic Reference: Paper presented: 4th European Ceramic Society Conference, Riccione (IT), October 2-6, 1995
Availability: Available from (1) as paper EN 39372 ORA
Record Number: 199511543 / Last updated on: 1995-12-12
Original language: en
Available languages: en