Community Research and Development Information Service - CORDIS

Abstract

Materials suffer changes to their microfabric when put under mechanical stress. Under high temperature creep stress, the surface bonds of the grains in the material can break up. The progress of this damage determines the life span of the material under the given stress conditions. In order to relate the actual damage to damage models, density, size and orientation of the cracks have to be determined. The modelling of the grain structure can simplify the damage analysis. A quantitative analysis of both the grain structure and the cracks has been realised through image processing of ground sections of pre-creeped samples. To this end, a programme has been designed for a quick recording and analysing of the data. Three grain models have been analysed for their suitability for the material AMCR0033. The results of the grain structure modelling were combined with the crack parameters in order to develop a damage variable by means of a microphysical model. Existing creep diagrams of AMCR0033 from previous experiments have been modelled by using an elasto-plastic material model, incorporating a phenomenological damage variable. The results of the micro-physical analysis are in full conformity with those of the phenomenological anlaysis.

Additional information

Authors: SCHWERTEL J, JRC Ispra (IT)
Bibliographic Reference: EUR 16369 DE (1996) 28pp., FS
Availability: Available from the Public Relations and Publications Unit, JRC Ispra, I-21020 Ispra (IT)
Record Number: 199610528 / Last updated on: 1996-05-27
Category: PUBLICATION
Original language: de
Available languages: de