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Abstract

Aluminium was incorporated into gold electrodes by underpotential desposition (upd) from an equimolar AlCl(3) + NaCl melt at 200 C, 250 C and 300 C. The process was studied by linear sweep voltammetry together with potentiostatic deposition/galvanostatic stripping. The deposits were characterized by electron microprobe analysis (EPMA) and glancing incidence X-ray diffraction (GIXRD). The electrochemical measurements showed clear evidence of intermetallic compound formation, and this was confirmed by the analysis, which showed several layers of successive bulk intermetallic compounds. The integral Gibbs energy of formation of the compounds is calculated and the kinetics of growth are described.

Additional information

Authors: RADOVIC B S, JRC Ispra (IT);EDWARDS R A H, JRC Ispra (IT);JOVICEVIC J N, JRC Ispra (IT)
Bibliographic Reference: Article: Journal of Applied Electrochemistry (1997)
Record Number: 199710319 / Last updated on: 1997-04-14
Category: PUBLICATION
Original language: en
Available languages: en