Joining of silicon nitride via a transient liquid
An alternative method to direct bonding has been proposed for creating high temperature resistant interfaces between ceramic materials. The method is partial transient liquid phase (PTLP) bonding. This modification of the transient liquid phase (TLP) method uses a multilayer metal composed of a thin insert outer layer on a thick core of refractory metal. A liquid is formed at the joining temperature which wets the solid surfaces and interdiffuses with the parent materials to transform into a more refractory solid material. Homogenization of the outer layer during bonding or subsequent thermal treatment makes it possible to produce joints with operation temperatures near or equal to that used in joining. PTLP-bonding of Si(3)N(4) with NiCr/Au and NiCr/Cu interlayers has been investigated. In the present study silicon nitride was joined to silicon nitride using multilayer inserts CuTi/Pd/CuTi and Ti/Cu/Ti. The ability of the combinations to form a transient liquid during joining and therefore their applicability for PTLP-bonding of Si(3)Ni(4) was studied. Flexural strengths of joints were determined at room temperature and at elevated temperatures up to 800 C. The joint microstructures and fracture surfaces were examined.
Bibliographic Reference: Article: Scripta Materiali (1996)
Record Number: 199711046 / Last updated on: 1997-09-16
Original language: en
Available languages: en