Community Research and Development Information Service - CORDIS

Abstract

Synthesis report on Contract No. BRPR-CT97-0588, from 1.2.1998 to 30.4.2001.

The development of the FUPUSET project has proved successful in having achieved one of the main goals, i.e. improved surface finish of micro machined components. A novel process step has been developed which reduces the surface roughness without deteriorating the anisotropic ratio during etching. Several methods to suppress the formation of pyramids without reducing the etch rate of Si(100) have been developed. Advances also have been made concerning the improvement of anisotropic ratios. An in depth understanding of the etching mechanism has been gained from several in-situ methods. Finally, video microscopy studies have demonstrated, that the adhesion of hydrogen bubbles, which are formed during the etching process, is responsible for the formation of defects on Si(100).

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Record Number: 4944 / Last updated on: 2003-04-17
Category: PROJ