Wspólnotowy Serwis Informacyjny Badan i Rozwoju - CORDIS

Low residue liquid fluxes and solder pastes for clean joining of electronic components

The project was directed at developing processes which form electrical joints without the need for post cleaning. Multicore's contribution was based upon a history of achievement in no clean soldering technology. Several novel low residue fluxes were offered to other project partners. Some have now been commercialised. The electronics industry relies on solder to form electrically conducting joints. Soldering techniques include wave soldering and reflow soldering. In both cases, flux is required to remove surface oxides and prevent further oxidation to facilitate efficient wetting by the solder. However, flux residues may impair the reliability of the finished produce by forming a conducting path between adjacent components or interfering with test equipment. Therefore, residue removal is often recommended. The group of solvents traditionally used chlorofluorocarbons (CFCs) is now subject to worldwide proscribing legislation in the light of their environmental impact. Environmental pressure remains a powerful guiding force within the electronics industry. Multicore is committed to continued product development which responds, and is well placed in terms of expertise and resource level. Experience gained before and during involvement in the project has heightened awareness of relevant technologies and their potential. European Community funded thermal analysis equipment has added to laboratory and pilot plant facilities ideally suited to the attainment of this goal. A third factor which complements expertise and resource level is collaboration and cooperation with other industrial academic bodies. Considerable benefit was derived from Multicore's involvement in the project in terms of cross fertilization of ideas and mutual technical support; an opportunity to participate in another collaborative venture would be welcomed. Fellow participants would influence the development of leading edge soldering materials from conception to commercialization.

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