Final Report Summary - PICS (Photonic Integrated Circuits and Systems) Here is a list of program objectives from the original proposal: 1. Objective: Become engaged in the ongoing efforts to design PICs for European multi-project runs.Execution: Enhance this effort by identifying new application areas for PICs, incorporating different design methodologies and sharing technical knowledge. There are currently four researchers at TeCIP/SSSUP involved in the new PIC effort, including the host scientist in charge. Dr. Klamkin will work closely with each of these researchers to transfer his expertise.2. Objective: Obtain commercial simulation software tools for designing device structures and PICs and train researchers and students on how to use them.Execution: Dr. Klamkin has worked with commercial simulation software such as those built by the RSoft Design Group and has built several working models that can be used to design the elements of common PICs. Dr. Klamkin will share these models with researchers and instruct on how to use them.3. Objective: Obtain commercial design tools for layout of fabrication photomasks and use to design PICs. Train students and researchers on how to use these tools.Execution: Dr. Klamkin has used a number of CAD layout tools. He also has experience with scripting automated layout generators that can be incorporated into such tools. Dr. Klamkin will build a library of elements for common PICs and share this with the researchers involved in the PIC effort. Note that the European PIC projects have their own automated layout generators. Dr. Klamkin’s layout generators will be used for the eventual foundry at TeCIP/SSSUP and could make a significant impact on the directions of the European PIC projects.4. Objective: Build relationships with companies, universities and research institutions to acquire the epitaxial materials required for the PICs and to establish working relationships for photonic foundry services. Dr. Klamkin will transfer knowledge on fabrication processes and procedures as well as the capabilities of different U.S. institutions so that the host institution can continue to work with these institutions.Execution: Dr. Klamkin has built working relationships with many institutions that could serve as partners for photonic foundry services. He will continue these relationships from TeCIP/SSSUP and transfer them there. He will educate the other researchers in the PIC effort at TeCIP/SSSUP on the capabilities of these institutions and how best to design epitaxial wafers and PICs for each institution.5. Objective: Transfer knowledge on how to build a characterization testbed for evaluating the PICs.Execution: Dr. Klamkin will build a PIC testbed at TeCIP/SSSUP and order all of the necessary components for this testbed including fiber positioning stages, samples satges, high-speed electrical. Klamkin will transfer all the specifications for these components and the vendor information, and will also train other researchers on how to perform the PIC characterization. This testbed will also serve as a model for other PIC testbeds.6. Objective: Assist in execution of new cleanroom facility at TeCIP/SSSUP and transfer knowledge on fabrication facilities, equipment and fabrication facilities. Also develop proposed PIP in this facility once it is operational.Execution: Dr. Klamkin will work closely with others part of the PIC team to plan the cleanroom facility. He will share contacts at vendors of fabrication equipment and knowledge on how to plan a cleanroom. Once the cleanroom is operation, Dr. Klamkin will develop the proposed PIP, which will establish and sustain the foundry efforts at TeCIP/SSSUP. He will carefully document procedures as they are developed so that researchers at TeCIP/SSSUP can continue to maintain these establish processes.Althought the project was terminated early, many of the objectives were met. Below is a summary of accomplishments.1. Designed monolithic photonic integrated circuit all-optical wavelength converter for telecommunications core network applications, and a multi-level advanced modulation format transmitter based on 16-quadrature amplitude modulation (QAM) using the European-based JePPIX indium phosphide based foundry service. To realize the integrated laser, a novel tunable laser based on an arrayed waveguide grating and semiconductor optical amplifiers was employed. These chips were fabricated at the COBRA Institute, Technical University of Eindhoven, have arrived at SSSUP and are under characterization.2. Designed 16-QAM zero-offset-free modulator structure and coherent receiver with digital coherence enhancement using the European-based PARADIGM indium phosphide based foundry service. These chips are being fabricated at Oclaro and Heinrich Hertz Institute and are expected to arrive within three months.3. Set up collaboration and infrastructure to become a user of US-based OPSIS silicon photonics foundry. Collaborated with several systems groups at SSSUP to conceptualize integrated photonics solutions for high capacity optical communications, photonic networks on chip, and microwave photonics applications. Designed a novel 16-QAM and DQPSK transmitter with tunable splitters for unbalancing optical power in nested Mach-Zehnder structure, coherent receiver based on balanced germanium photodiode and optical hybrid designed without waveguide crossings to reduce crosstalk, polarization diverse coherent receiver, coherent receiver with digital coherence enhancement to estimate the phase noise of the local oscillator laser and compensate for this in post reception signal processing, muxponder for converting 4 on-off-keying (OOK) signals to a 16-QAM signal while also converting to any desired output wavelength, 4x4 non-blocking space switch for photonic networks on chip, cascade Mach-Zehnder modulator structure for photonics-based radar application, DPSK receiver for 25Gb/s signals, frequency discriminator-based DPSK receiver, optical phase lock loop (OPLL) coherent receiver, novel germanium photodiode designs for high power. These chips were fabricated at IME in Singapore and have been delivered to SSSUP and are under characterization.4. Set up and led collaboration with silicon photonics group at Ghent University/IMEC in Belgium to develop hybrid-integrated lasers for various silicon photonic integrated circuits. Proposed novel concepts, which are under development, to hybrid-integrated lasers on standard 220-nm thick silicon on insulator technology, which had never been achieved before. This collaboration involved sending a researcher to Ghent to interact with silicon photonics group to acquire and learn their simulation and design tools, to learn the design kit for European-based silicon photonics IMEC foundry service through epixFAB, and gain some training in cleanroom. A design of silicon advanced modulation format modulators structures to be integrated with indium phosphide hybrid lasers was submitted to an IMEC multi-project wafer run. Structures were also incorporated on the mask described in point 3 to allow for eventual integration of the hybrid lasers for a local oscillator for the coherent receiver and coherent receiver with digital coherence enhancement. Organized a joint-PhD position between SSSUP and Ghent University and recruited a student (after screening more than 20 applicants) that will begin this PhD program within a few months.5. Acquired a number of design and simulation tools utilizing the beam propagation method (BPM), finite difference time domain (FDTD), finite element method (FEM), as well as mask layout tools that were used for designing the devices in points 3 and 4.6. Acquired a number of advanced components for high-speed characterization that are being used for characterization of the chips in points 3 and 4 including high-speed multiprobes, bias-tees.7. Coauthored an Optics Letters paper on, “Versatile Offset-Free 16-QAM Single Dual-Drive IQ Modulator Driven by Binary Signals.”8. Coauthored a paper presented at Globecom 2012 conference on, “Versatile Low-Complex 16-QAM Optical Transmitter Driven b Binary Signals.”9. Coauthored a patent submitted to US patent office in collaboration with Ericsson on, “Versatile Low-Complex 16-QAM Optical Transmitter Based on Tunable Splitters and Driven by Binary Signals.”10. Coauthored a patent that is in progress of submission in collaboration with Ericsson on, “Integrated OOK to 16-QAM Muxponder Transceiver.”11. Acted as local coordinator for European project proposal on integrated reconfigurable optical switch in silicion that will be submitted to upcoming FP7 call.12. Acted as local coordinator for European project proposal on phase modulated radio over fiber link technologies for hybrid access networks that will be submitted to upcoming FP7 call.13. Acted as local coordinator for European project proposal on coherent agile silicon transceivers with hybrid integrated lasers for metro network applications that will be submitted to upcoming FP7 call.14. Helped to build a new center for integrated photonic technologies that will realize a state-of-the-art 800-square meter nanofabrication facility. Provided the high-level layout of the cleanroom facility and design of different clean spaces, selected all of the fabrication equipment totaling more than 7 million Euros of equipment, provided a vision for which technologies would be developed in this facility, built website and brochure for this center, organized a guideline of operation for eventual facility, helped with the proposal that is funding this facility. The construction of this facility will begin within a few days.
