Community Research and Development Information Service - CORDIS


TOP HIT Report Summary

Project ID: 645314
Funded under: H2020-EU.

Periodic Reporting for period 1 - TOP HIT (Transfer-print operations for heterogeneous integration)

Reporting period: 2015-02-02 to 2016-08-01

Summary of the context and overall objectives of the project

Our project on “Transfer-print OPerations for Heterogeneous InTegration” (TOP-HIT) addresses the programme topic ICT 2 -2014 on Smart System Integration which seeks:

“To develop the next generations of smart systems technologies and solutions, based on systemic miniaturisation and integration, of heterogeneous technologies, functions and materials, and to establish European competitive ecosystems for the design, R&D, prototyping and testing, manufacturing and industrialisation of smaller, smarter (predictive, reactive and cognitive) and energy autonomous Smart Systems.”

The successful outcome of the TOP HIT project will result in a universal heterogeneous integration technology of transferrable functional components based upon thin electronic and photonic structures for use in low cost integrated subsystems. The technology will have been proven in a manufacturing environment leading to clear validation for its uptake by European industry.

Some of the specific objectives of the TOP-HIT proposal are to:
1. Develop micro-transfer print as a versatile, low cost, scalable, reliable technology for the compact, 3D and 2D+1 heterogeneous integration of thin functional materials and devices.
2. Validate the device integration and performance through demonstration in functional subsystems on two different technology platforms (photonics and electronics)
3. Establish the design rules for the micro-transfer print technology.
4. Demonstrate functionality that cannot be obtained by other techniques thus providing the state of the art in electronic and photonic integration.
5. Provide a technology toolbox to enable rapid development of future products
6. Nurture cross disciplinary interactions
7. Establish leadership in 3D heterogeneous integration and provide a route to the technology being widely adopted by enabling transfer print in foundry services

Work performed from the beginning of the project to the end of the period covered by the report and main results achieved so far

The first photonics components have been successfully integrated. The photonics end-user sees commercial opportunities for the printed product.

For the electronics section of the project, tethering structures have been optimized and first electronic components have been designed. Designs have been adjusted to ensure compatibility, as wafers move from X-FAB to X-CELEPRINT and finally to SEAGATE. A first full run of customized coupons and customized target wafers is due to be completed in early August 2016, and test results on integrated devices are expected in late September 2016.

Progress beyond the state of the art and expected potential impact (including the socio-economic impact and the wider societal implications of the project so far)

The first photonics components have been successfully integrated. The photonics end-user sees commercial opportunities for the printed product.

X-CELEPRINT, the SME company in the TOP-HIT consortium is undergoing expansion, and recently added two new people to its team in Cork.

Related information

Follow us on: RSS Facebook Twitter YouTube Managed by the EU Publications Office Top