Community Research and Development Information Service - CORDIS

ELECTROLYTIC FAST METAL PLATING MODULE FOR WAFERS.

Met-Coat is developing an automatic (Cu, Au, Ag, Pt, NI) electroplating module for microelectric wafers, with the advantage of high deposition rate, uniformity and adhesion. Its electrical and mechanical properties equal to metal sheets. The method is superior to sputtering and electroless processes. A prototype has been made of an automatic electroplating module for microelectronic wafers, which are superior to any existing processes for electroplating.
The deposition rate is up to 20micron/min, with uniformity of 1micron over 100mm. The process yields sharp and clear edges at masking zones. Current density is up to 200 Amp/dm2 with an operation temperature of 20-70oC.

Contact

Aaron STERN
Tel.: +972-3-5170150
Fax: +972-3-5177655
E-mail
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