Community Research and Development Information Service - CORDIS

Advanced test chip design for assembly and interconnection assessment

Based on the different requirements of the user partners in the consortium, a total of 21 different test chips have been defined, which can be divided in 4 categories of size (A: 0.5 X 1.5 mm, B: 7 X 7 mm, C: 15 X 15 mm and D: 2.5 X 15 mm). The testchips contained a selection of different test structures for measuring electrical, thermal, diffusion and mechanical stress properties.

Reported by

Alcatel Microelectronics
Westerring 15
B-9700 Oudenaarde
Belgium
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