Community Research and Development Information Service - CORDIS

High density electroless Ni/Au contact bump deposition

This task has demonstrated the feasibility of electroless Ni/Au bumping process for very high density flip chip interconnections by using thick vertical sidewall photo-resistant process. Previously the photo-resistant materials used in the industry have not been able to stand the harsh chemical and thermal conditions common in electroless nickel bumping. The requirements and support of parties in this project encouraged and made possible for Picopak not only the development work but also the improvement of the existing production line.

Since June 1998 the improved production line and new materials have been successfully in production. So far monthly volumes of one million bumped and flip-chip assembled dice have been delivered to the customers. That indicates already a good volume production potential, but further development of the photo-resistant process and production lines are continuing for improving the efficiency and consistency of the quality.

Reported by

Picopak Oy
1,Teollisuuskatu
08150 Lohja
Finland
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