Community Research and Development Information Service - CORDIS

New range of flip chip adhesives

According to the different process and product requirements of the project partners concerning the curing conditions, the thermo-mechanical performance and the interconnection mechanism, Heraeus developed three systems for flip chip bonding in the range NCA (non conductive adhesive), ACA (anisotropic conductive adhesive) and ICA (isotropic conductive adhesive):

All three systems being developed had to fulfil a number of requirements concerning:
-Adhesion Strength
-Bubble free layers
-Ion concentration
-Curing conditions

NCA are the basic systems for ACA and ICA respectively. In addition they can be used for a special flip chip technology developed at IMEC.


Hans-Werner HAGEDORN
Tel.: +49-618-1355818
Fax: +49-618-1359131
Record Number: 25470 / Last updated on: 2001-02-19
Information source: e-TIP
Collaboration sought: Information exchange/Training
Stage of development: Other
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