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FP5

EFSOT Résumé de rapport

Project ID: G1RD-CT-2002-00838
Financé au titre de: FP5-GROWTH
Pays: France

Test board to evaluate lead-free soldering process and materials

To allow a systematic and precise evaluation of new EFSOT solder paste, a test board was developed, it is used to validate all kinds of very fine pitch printing and soldering as well as more specific needs such as: cleaning feasibility, insulation properties, power components soldering, compatibility of various PCB finishing (Imm Tin, Imm Silver, Gold, OSP, thickfilm Ag/Cu) with LF solder etc...

The design did contain the different standard pattern of TTA, Philips and AB for comparison and has been used intensively by TTA, Philips and AB to manufacture boards and validate the soldering processes (Screen printing parameters and cleaning, paste deposite, demolding and abandon time, Oven profiles)

This test is a major support for implementing high yield lead-free processes. The window framing design of AB was found to give best results in high volume production using AOI.

Informations connexes

Reported by

Thomson R&D France
1, Avenue de Belle-Fontaine-CS 17616
35576 CESSON-SEVIGNÉ
France
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