Community Research and Development Information Service - CORDIS

FP5

IMECAT Report Summary

Project ID: G1RD-CT-2002-00711
Funded under: FP5-GROWTH
Country: Belgium

Cost-effective connection of flex to glass using isotropic conductive and non-conductive adhesives

This technology has been developed as a flip-chip interconnection of silicon dies onto printed circuit boards (PCBs) using adhesives. The technology uses a combination of non-conductive adhesives (NCA) and isotropic conductive adhesives (ICA). The principle of the technology was invented earlier and a US patent was granted for this invention. However this technology using adhesives was changed inside the IMECAT project to be used for connecting flex to glass and be more cost-effective. For this process the first step is to stencil print the ICA onto the flexible circuit board or the glass substrate and drying it without fully curing the adhesive.

For cost reasons, stencil printing and drying can be done on bigger sized boards before cutting it into the final shape. In this way 1 print stroke can be used to print several substrates. After the cutting, the NCA can be dispensed onto the dried ICA in an appropriate pattern. As a final step the glass of the flexible substrates can be placed onto the adhesives, which are then cured by thermo-compression. In this way stable low resistance contacts can be achieved which are also reliable. This technology however has more process steps then using anisotropic conductive adhesives (ACA), but because the base materials in our technology are much cheaper this ICA-NCA interconnection is most likely to be more cost-effective.

Related information

Reported by

IMEC
Technology Park - Buidling 914-A
9052 Gent-Zwijnaarde
Belgium
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