Servicio de Información Comunitario sobre Investigación y Desarrollo - CORDIS

FP5

BILAPS Informe resumido

Project ID: ENK6-CT-2001-00544
Financiado con arreglo a: FP5-EESD
País: Netherlands

Process of the lead plating of the bipolar plate

The process of lead-alloy plating of conductive fluorpolymer bipolar plates was developed on a laboratory scale. An ECD (Electro Chemical Deposition) pilot plating line, capable of semi-industrially plating the bipolar plates with a well defined lead alloy coating was build, tested and used for small series production. The process includes pre- and post treatment of these difficult to plate materials.

- What are the potential applications for this result?
Coating bipolar plates and grids for the BILAPS power source.

- Who are the end-users of this result?
Electro plating companies and battery manufacturers.

- What are the main innovative features/benefits? (Technical/commercial success factors)
Know how of handling, pre- and post treatment and ECD processing of non-metallic conducting materials.

-Analysis of the market or application sectors:
Bipolar batteries.

-Potential barriers:
Cost, yield, protection of knowledge (mainly know how).Relation between grain size of the base material and the porosity of the electroplated top layer.

Información relacionada

Reported by

PGE B.V.
Glaslaan 2, P.O. Box 80064
5600 KA Eindhoven
Netherlands
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