Community Research and Development Information Service - CORDIS

Speeding-up packaging steps

With the growth of miniaturised applications steadily increasing, fast production is the most important aspect in focus. Towards this need, a German company has developed a new technology for integrating packaging, interconnection and housing into one step procedure.
Speeding-up packaging steps
The so-called 3D-CSP (3 Dimensional Chip Size Packaging) developed technology is an innovative approach for incorporating several small-sized parts and structures for a variety of forms into an integrated system. It includes a sophisticated microsystem that has the potential of combining the steps of packaging, interconnection and housing of complex systems into a single step procedure. This feature expedites the packaging procedure and thus, allows the fast production of miniaturised systems.

On the grounds of an already developed "without tooling" approach, the 3D-CSP leads to minimisation of development times and costs and to the maximisation of production. Moreover, the packaging of the chip scale has the potential to increase the level of miniaturisation and performance of products.

This simple and efficient packaging solution may be used in packaging services providing a route to complete microsystems development and production. Used either for prototyping as well as for batch production, the benefits are obvious for a broad range of applications in the miniature module market. More specifically, this packaging technology is expected to boost the microelectronics industry (high density packaging of sensors). In addition, the technology is also offered to companies within optics (wafer scale lens and fiber coupling), gene technology and biotechnology (cell processors and lab on chip), medicine and medical supplies (micro needles and micro filters) and other related fields. The company provides full service including technical and strategic consulting, especially for start-up companies.

Related information

Record Number: 80613 / Last updated on: 2005-09-18
Domain: Industrial Technologies