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EuroCPS project helps over 30 SMEs build new cyber-physical products for the CPS market, creating more than 100 jobs and 10 M€ additional revenues.

Contributed by: CEA

The EuroCPS project, H2020 funded, has been helping over 30 SMEs build new cyber-physical products for the cyber-physical and embedded systems market: more than 100 jobs were created between 2016 and 2018, and 100 additional ones are expected over the next two years. EuroCPS has contributed to €10 million additional revenue between 2016 and 2018, €17 million additional revenue is expected between 2018 and 2019, and the exponential growth is expected to continue over the next coming years.

EuroCPS project helps over 30 SMEs build new cyber-physical products for the CPS market, creating more than 100 jobs and 10 M€ additional revenues.
EuroCPS has supported over 30 European companies to create innovative cyber-physical products for emerging Internet of Things (IoT) markets, while increasing their turnover and growing their teams. Coordinated by CEA Leti and funded by the European Commission, this three-year, €9.2 million project helped innovators (at small/medium enterprises, or SMEs, and large companies) overcome the barriers they face when entering new markets.

“European companies wishing to enter IoT markets often lack knowledge about the value chain and the skills to master the entire design process from ideas to products,” explains EuroCPS Coordinator Isabelle Dor (CEA Leti). “In response, EuroCPS set up a one-stop shop, providing an easy way to access technical expertise, business coaching and advanced cyber-physical platforms. To help lessen the risks involved in launching a new product, EuroCPS also provided seed funding of up to €150,000 per SME.”

By facilitating access to the latest technologies, along with the combined expertise of a cluster of research technology organizations and universities, EuroCPS has allowed companies to speed up product development and accelerate market entry, creating jobs and driving new business along the way. More than 100 jobs were created over the period between 2016 and 2018, and 100 additional ones are expected for the next 2 years. EuroCPS also contributed to €10 million additional revenue for the same period, and €17 million additional revenue is expected between 2018 and 2019, with a continuing exponential growth for the years to come.

The project linked the software, system and nano-electronic industries along the full cyber-physical system (CPS) value chain to demonstrate a new cooperation model. This was demonstrated by 34 novel industrial experiments funded through three open calls to develop innovative CPS products.

Launched in 2015, EuroCPS brings together 14 partners from nine countries who established a network of design centres to help companies develop innovative products for emerging Internet of Things (IoT) markets. EuroCPS members are major European system suppliers, world-class research centres and technology providers, all rooted in the top European regional ecosystems: AVL (Austria), CEA (France), Digital Catapult (UK), Finepower (Germany), Fraunhofer (Germany), HTNL (the Netherlands), Infineon (Austria), Intel (Ireland), ST (France & Italy), Technical University of Lulea (Sweden), Thales (France), University of Bologna (Italy), University of Budapest (Hungary).

EuroCPS is part of the Smart-Anything-Everywhere Initiative under the Horizon 2020 Leadership in Enabling Industrial Technologies program, which aims to generate new and breakthrough technologies, boost competitiveness, create jobs and support growth by offering a Europe-wide network of design centres. Four innovation actions combined efforts under the €25 million funding budget to support around 100 industrial experiments, involving more than 200 SMEs and midcaps in the field of cyber-physical systems (CPS), Internet of Things (IoT) and smart systems integration (SSI).

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Countries (9)

  • Austria, Germany, France, Hungary, Ireland, Italy, Netherlands, Sweden, United Kingdom

Keywords

CPS, EMbedded systems, Smart Anything Everywhere, DIH
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