Skip to main content
European Commission logo print header

European 450mm Equipment & Materials Initiative

Objective

Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, major chipmakers are considering offsetting the growing costs of miniaturisation by increasing wafer size to 450mm to cut cost per produced die. A prerequisite is the availability of the required quality wafers and equipment able to handle larger wafers. The ENIAC JU project EEMI450 brings together the major European specialists to start such work to maintain and extend their leading role in the development and production of semiconductor equipment and materials.

Call for proposal

ENIAC-2009-1
See other projects for this call

Coordinator

ASM INTERNATIONAL N.V.
EU contribution
€ 205 408,00
Address
VERSTERKERSTRAAT 8
1322 AP ALMERE
Netherlands

See on map

Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
Administrative Contact
Links
Total cost
No data

Participants (26)