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Yield Control in SMD Assembly

Ziel

The aim of this action was to develop a specification for a yield improvement system for fine-pitch surface-mounted device (SMD) assembly, particularly in SMEs.
The aim of this action was to develop a specification for a yield improvement system for fine pitch surface mounted device (SMD) assembly, particularly in small and medium sized enterprises (SME). The consortium identified the state of the art and the definition of needs for fine pitch surface mount assembly (SMA) within SMEs. The particular problems of fine pitch SMA were studied, including soldering techniques, failure analysis and reliability evaluation. The testability of fine pitch assemblies was also assessed. The specification of the yield improvement system included designing the assembly for high yield, operator training and statistical process control.

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Koordinator

WELD-EQUIP
EU-Beitrag
Keine Daten
Adresse
ENGELSEWEG, 164, 164
5700 AD HELMOND
Niederlande

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Beteiligte (3)