Project description DEENESFRITPL Candidate insulating material paves the way for more powerful and smaller chips A modern electronic chip presents a complex system of billions connected computing and information storage nodes. Having this system the size of a fingernail means an extremely dense packing of its elements. The associated miniaturization of on-chip wiring results in a delayed signal transfer between the nodes and in increased power consumption. One way to approach the above down-scaling challenges is to embed air-like and yet mechanically robust insulating materials between nanoscale metal wires. The EU-funded LO-KMOF project aims at integration of metal-organic frameworks, a novel class of highly porous crystalline materials, in on-chip wiring using an industry-compatible chemical vapor deposition process. The success of this project would contribute to a new generation of faster and more energy-saving electronics. Show the project objective Hide the project objective Objective Since the invention of integrated circuits, there has been a persistent incentive towards miniaturization. An indispensable part of every chip is a multi-level wiring system fabricated on top of the semiconductor layer containing the transistors. As transistors get smaller and more densely packed, the complexity and the impact on performance of the on-chip interconnects rises. The non-zero resistance and capacitance associated with the metal wires and the dielectric medium between them induce cross-talk noise between adjacent interconnects, limit the speed of signal propagation and increase the power consumption of a chip. The LO-KMOF project proposes an approach to alleviate these issues by integrating for the first time metal-organic frameworks as an interconnect dielectric. The project will make use of a novel vapour phase deposition approach for these materials, developed in the ERC project VAPORE. If successful, the project will contribute to chips that are not only faster but also consume less power. The proposed technology will be validated in an industrially relevant demonstrator. Fields of science natural sciencesphysical scienceselectromagnetism and electronicssemiconductivityengineering and technologynanotechnologynanoelectronics Programme(s) H2020-EU.1.1. - EXCELLENT SCIENCE - European Research Council (ERC) Main Programme Topic(s) ERC-2019-POC - ERC Proof of Concept Grant Call for proposal ERC-2019-PoC See other projects for this call Funding Scheme ERC-POC-LS - ERC Proof of Concept Lump Sum Pilot Host institution KATHOLIEKE UNIVERSITEIT LEUVEN Net EU contribution € 120 000,00 Address OUDE MARKT 13 3000 Leuven Belgium See on map Region Vlaams Gewest Prov. Vlaams-Brabant Arr. Leuven Activity type Higher or Secondary Education Establishments Links Contact the organisation Opens in new window Website Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Total cost No data Beneficiaries (2) Sort alphabetically Sort by Net EU contribution Expand all Collapse all KATHOLIEKE UNIVERSITEIT LEUVEN Belgium Net EU contribution € 120 000,00 Address OUDE MARKT 13 3000 Leuven See on map Region Vlaams Gewest Prov. Vlaams-Brabant Arr. Leuven Activity type Higher or Secondary Education Establishments Links Contact the organisation Opens in new window Website Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Total cost No data INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM Belgium Net EU contribution € 30 000,00 Address KAPELDREEF 75 3001 Leuven See on map Region Vlaams Gewest Prov. Vlaams-Brabant Arr. Leuven Activity type Research Organisations Links Contact the organisation Opens in new window Website Opens in new window Participation in EU R&I programmes Opens in new window HORIZON collaboration network Opens in new window Total cost No data
