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Contenuto archiviato il 2024-05-23

Interconnection materials for environmentally compatible assembly technologies

Obiettivo

The project aims to develop interconnection materials, i.e. lead-free solders and adhesives (ICA: isotropically conductive adhesives and NCA : non conductive adhesives) for environmentally compatible assembly technology of electronic systems. Using the new materials a wide variety of interconnection technologies will be developed for automotive, LCD, telecom systems, smart card/smart label and portable telecom applications. Emphasis wil be put on advanced flip-chip technologies. The technology developments will be validated by design, fabrication and testing of demonstrators for each of the applications mentioned. The project consortium has 9 partners from 5 different EU member states.

Invito a presentare proposte

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Meccanismo di finanziamento

CSC - Cost-sharing contracts

Coordinatore

INTERUNIVERSITAIR MIKRO-ELEKTRONICA CENTRUM VZW
Contributo UE
Nessun dato
Indirizzo
St. Pietersnieuwstraat 41
9000 GENT
Belgio

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Costo totale
Nessun dato

Partecipanti (8)