Numerical simulation of packaging processes for electronic devices

Projektinformationen

SIMPACK

ID Finanzhilfevereinbarung: G5TR-CT-2001-00065

Projekt abgeschlossen

Startdatum 1 Dezember 2001

Enddatum 30 November 2005

Finanziert unter

• Programme for research technological development and demonstration on "Competitive and sustainable growth 1998-2002"

Gesamtkosten € 170 400,00

EU-Beitrag € 170 400,00

Koordiniert durch

ROBERT BOSCH GMBH.
Germany

Ziel

Computer modelling of material characteristics in packaging and encapsulation processes, experimental validation, implementation to FEM-based software codes, adaptation to specific processes.

Wissenschaftliches Gebiet

• natural sciences › computer and information sciences › software

Programm/Programme

• FP5-GROWTH - Programme for research technological development and demonstration on "Competitive and sustainable growth 1998-2002"

Thema/Themen

• 1.1.3.-5. - RTD Activities of a Generic Nature : materials and their technologies for production and transformation and new and improved materials and production technologies in the steel field

Aufforderung zur Vorschlagseinreichung

Data not available

Finanzierungsplan

BUR - Bursaries, grants, fellowships

Koordinator

ROBERT BOSCH GMBH.

• EU-Beitrag: Keine Daten
• Adresse: ROBERT-BOSCH PLATZ 1 ; 70049 STUTTGART ; Deutschland
• Gesamtkosten: Keine Daten