Numerical simulation of packaging processes for electronic devices

Informations projet

SIMPACK

N° de convention de subvention: G5TR-CT-2001-00065

Projet clôturé

Date de début 1 Decembre 2001

Date de fin 30 Novembre 2005

Financé au titre de

• Programme for research technological development and demonstration on "Competitive and sustainable growth 1998-2002"

Coût total € 170 400,00

Contribution de l’UE € 170 400,00

Coordonné par

ROBERT BOSCH GMBH.
Germany

Objectif

Computer modelling of material characteristics in packaging and encapsulation processes, experimental validation, implementation to FEM-based software codes, adaptation to specific processes.

Champ scientifique

• natural sciences › computer and information sciences › software

Programme(s)

• FP5-GROWTH - Programme for research technological development and demonstration on "Competitive and sustainable growth 1998-2002"

Thème(s)

• 1.1.3.-5. - RTD Activities of a Generic Nature : materials and their technologies for production and transformation and new and improved materials and production technologies in the steel field

Appel à propositions

Data not available

Régime de financement

BUR - Bursaries, grants, fellowships

Coordinateur

ROBERT BOSCH GMBH.

• Contribution de l’UE: Aucune donnée
• Adresse: ROBERT-BOSCH PLATZ 1 ; 70049 STUTTGART ; Allemagne
• Coût total: Aucune donnée