Numerical simulation of packaging processes for electronic devices

Project Information

SIMPACK

Grant agreement ID: G5TR-CT-2001-00065

Project closed

Start date 1 December 2001

End date 30 November 2005

Funded under

• Programme for research technological development and demonstration on "Competitive and sustainable growth 1998-2002"

Total cost € 170 400,00

EU contribution € 170 400,00

Coordinated by

ROBERT BOSCH GMBH.
Germany

Objective

Computer modelling of material characteristics in packaging and encapsulation processes, experimental validation, implementation to FEM-based software codes, adaptation to specific processes.

Fields of science

• natural sciences › computer and information sciences › software

Programme(s)

• FP5-GROWTH - Programme for research technological development and demonstration on "Competitive and sustainable growth 1998-2002"

Topic(s)

• 1.1.3.-5. - RTD Activities of a Generic Nature : materials and their technologies for production and transformation and new and improved materials and production technologies in the steel field

Call for proposal

Data not available

Funding Scheme

BUR - Bursaries, grants, fellowships

Coordinator

ROBERT BOSCH GMBH.

• EU contribution: No data
• Address: ROBERT-BOSCH PLATZ 1 ; 70049 STUTTGART ; Germany
• Total cost: No data