Objective
GALACTIC will develop innovative key technologies for affordable multicomponent Ka-band subsystems. These technology building blocks are: low cost, highly integrated GaAs MMICs and LTCC technologies for critical millimeter-wave components and power chip insertion. They will be integrated and validated in the next generation Ka-band VSAT transmitter, which is required for various new products in next generation satellite broadband communication networks. Through GALACTIC, these building blocks will become affordable, reliable and adequate for mass production. Many future wireless communication products and networks will thus have their prices substantially reduced and the viability of their fabrication process will be ensured.
Objectives:
GALACTIC will develop innovative key technologies for high performance, affordable, multi-component Ka-band subsystems. The objective of the GALACTIC project is to lay the foundations to achieve this goal. The key innovative technologies are compact multifunctional circuits (MFCs) based on integrated Gallium Arsenide (GaAs) monolithic microwave integrated circuits (MMICs), low temperature co-fired ceramics (LTCC) for high-power Ka-band applications, their integration and packaging. Those technologies are required for the design, fabrication and validation of a low cost, multi-component high-power Ka subsystem adequate for high volume production. They will be integrated and validated on a Ka-band up-converter transmitter, which is the key building block of various future products for next generation broadband access systems.
Work description:
The consortium will develop the following technologies required to produce the multi-component Ka-band subsystems:
- Low cost LTCC technology for compact and low loss millimeter-wave circuitry e.g.transitions filters and electromagnetic shielding for internal decoupling of individual functions;
- LTCC-technology for power amplifiers which will improve substantially the power dissipation capability of LTCC, e.g. by introducing large metallized thermal vias as a prerequisite to use low cost LTCC substrate for power applications;
- A highly integrated and efficient chip set will be developed, by using new power cell designs, and compact multifunctional MMICs integrating more functions on one chip. The chip surface encapsulation by innovative coatings will be introduced in the Ka-band frequency range;
- Low-cost and very compact LTCC-based multilayer packaging and assembly technologies ensuring environmental protection and electromagnetic shielding.
The technologies developed will be integrated and validated through a test subsystem representing a key part of a real communication system: a Ka-band up-converter transmitter for future Very Small Aperture Terminal (VSAT) Out Door Unit (ODU). The subsystem will then be demonstrated and validated. Finally, the subsystem functionality and performance will be tested at the system level in order to meet ETSI/FCC requirements. The demanding performance and cost requirements at high frequencies will be achieved by simultaneous R&D and close co-operation between the developing partners engaged on materials, component, subsystem and system level together with the experts on high volume production techniques.
Milestones:
M04 - System requirements
M12 - Final specifications on subsystem level
M20 - Packaging concept
M21 - Low-cost Ka-band/LTCC upgrade
M22 - MMIC chip set available
M28 - Engineering samples of Ka-band up-converter transmitter.
Fields of science (EuroSciVoc)
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
CORDIS classifies projects with EuroSciVoc, a multilingual taxonomy of fields of science, through a semi-automatic process based on NLP techniques. See: The European Science Vocabulary.
- engineering and technology mechanical engineering vehicle engineering aerospace engineering satellite technology
- natural sciences chemical sciences inorganic chemistry post-transition metals
- engineering and technology materials engineering coating and films
- engineering and technology materials engineering ceramics
You need to log in or register to use this function
We are sorry... an unexpected error occurred during execution.
You need to be authenticated. Your session might have expired.
Thank you for your feedback. You will soon receive an email to confirm the submission. If you have selected to be notified about the reporting status, you will also be contacted when the reporting status will change.
Programme(s)
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Multi-annual funding programmes that define the EU’s priorities for research and innovation.
Topic(s)
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Calls for proposals are divided into topics. A topic defines a specific subject or area for which applicants can submit proposals. The description of a topic comprises its specific scope and the expected impact of the funded project.
Call for proposal
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Data not available
Procedure for inviting applicants to submit project proposals, with the aim of receiving EU funding.
Funding Scheme
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Funding scheme (or “Type of Action”) inside a programme with common features. It specifies: the scope of what is funded; the reimbursement rate; specific evaluation criteria to qualify for funding; and the use of simplified forms of costs like lump sums.
Coordinator
49130 PETACH TIKVA
Israel
The total costs incurred by this organisation to participate in the project, including direct and indirect costs. This amount is a subset of the overall project budget.