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Innovative Nano and Micro Technologies for Advanced Thermo and Mechanical Interfaces

Innovative Nano and Micro Technologies for Advanced Thermo and Mechanical Interfaces

Objective

Future electronic power devices and packages will need to demonstrate more performance and functionality at reduced cost, size, weight, energy consumption and thermal budget. Further, increasing reliability demands have also to be met by industry to be competitive in this growing multi-billion Euro market of heterogeneously integrated systems.To respond to these challenges, new innovative nano- and micro-technologies and materials, both of which are key enablers for advanced thermal and mechanical interfaces, have to be developed and compatibly integrated to obtain higher electrical, thermal and reliability performance under harsh environmental conditions.Nanotherm's objective is to take up these challenges in design, technology and test:Novel approaches to thermal technologies with superior electrical, thermal and thermo-mechanical properties will be developed in the project and demonstrated on automotive, avionics, solid-state lighting and industrial applications. Parallel routes will be followed addressing nano-sinter-adhesive bonding, phonon-coupled VACNT joining, nano-functionalised nano-filled adhesive die attach and graphene-enhanced surfaces. The main principle common to all technologies is the exploitation of nano-effects to obtain outstanding interconnect properties by especially developed processes.In parallel, a multi-scale and multi-domain modelling framework will furnish guidelines for materials design by various approaches from ab-inito up to continuum modelling and verified by corresponding experimental techniques.The consortium, composed of 18 partners from industry, SME and academia out of 8 European countries, embodies the necessary excellence and interdisciplinarity to address these tasks successfully. We are convinced that Nanotherm's results will enable the next generation of heterogeneously integrated power packages, cut down thermal interface resistance at least by 50% and impact also on other power system-in-package configurations.
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Coordinator

THALES SA

Address

Tour Carpe Diem Place Des Corolles Esplanade Nord
92200 Courbevoie

France

Activity type

Other

EU Contribution

€ 1 157 825

Administrative Contact

Olivier PREVOTAT (Mr.)

Participants (17)

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INFINEON TECHNOLOGIES AG

Germany

EU Contribution

€ 524 392

AMIC ANGEWANDTE MICRO-MESSTECHNIK GMBH

Germany

EU Contribution

€ 225 202

HERAEUS DEUTSCHLAND GMBH & CO KG

Germany

EU Contribution

€ 215 000

BERLINER NANOTEST UND DESIGN GMBH

Germany

EU Contribution

€ 279 250

ROBERT BOSCH GMBH

Germany

EU Contribution

€ 271 810

TECHNISCHE UNIVERSITAET CHEMNITZ

Germany

EU Contribution

€ 288 822

FUNDACIO INSTITUT CATALA DE NANOCIENCIA I NANOTECNOLOGIA

Spain

EU Contribution

€ 226 764

CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRS

France

EU Contribution

€ 202 064

BUDAPESTI MUSZAKI ES GAZDASAGTUDOMANYI EGYETEM

Hungary

EU Contribution

€ 262 223

BME VIKING ELECTRICAL ENGINEERING INFORMATION TECHNOLOGY

Hungary

EU Contribution

€ 247 224

PHILIPS ELECTRONICS NEDERLAND B.V.

Netherlands

EU Contribution

€ 323 047

TECHNISCHE UNIVERSITEIT EINDHOVEN

Netherlands

EU Contribution

€ 339 945

POLITECHNIKA WROCLAWSKA

Poland

EU Contribution

€ 207 750

Amepox

Poland

EU Contribution

€ 265 400

ATEP - AMKOR TECHNOLOGY PORTUGAL SA

Portugal

EU Contribution

€ 285 382

CHALMERS TEKNISKA HOEGSKOLA AB

Sweden

EU Contribution

€ 438 900

SHT SMART HIGH-TECH AB

Sweden

EU Contribution

€ 309 000

Project information

Grant agreement ID: 318117

Status

Closed project

  • Start date

    1 September 2012

  • End date

    29 February 2016

Funded under:

FP7-ICT

  • Overall budget:

    € 9 514 464

  • EU contribution

    € 6 070 000

Coordinated by:

THALES SA

France