Tomorrows micro-electronic devices will have to show more functionality and performance at smaller form factor, lower cost and lower energy consumption in order to be competitive on this multi-billion dollar market. Advanced system integration is thus inevitable, a trend bound to joining dissimilar materials with new packaging technologies. These processes must enable lower thermal resistances and higher interconnect density and device reliability under thermomechanical loading.
Hyperconnect addresses these challenges by a radically new material joining process. The objective is to demonstrate superior electrical, thermal and thermomechanical performance and to combine design and technology with the support of simulation and testing. The central new idea comprises a sequential joint forming process, using self-assembly of nanoparticles, polymers and filler composite materials exploiting capillary action and chemical surface functionalisation: In other words, the formed joint reaches its outstanding properties by the very processing of the materials. This contrast to existing technology demands own understanding of the joint formation, joint property creation and the joint reliability.
Therefore advanced experimental characterization and simulation techniques will accompany the material and technology development, in particular involving physics-of-failure-based lifetime modelling. Finally, the joint performance will be validated on four different demonstrators of industrial significance.
To tackle these challenging issues the consortium pools the required interdisciplinary excellence, by uniting nine partners from industry, SMEs and academia of five European countries. Its members are convinced that these new developments will outperform commercially available solutions by one order of magnitude and will radiate out also to other fields in electronic packaging.
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