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Energy efficient Silicon transmittEr using heterogeneous integration of III-V QUantum dOt and quantum dash materIAls

Energy efficient Silicon transmittEr using heterogeneous integration of III-V QUantum dOt and quantum dash materIAls

Objective

Silicon photonics is a powerful way to combine the assets of integrated photonics and CMOS technologies. The SEQUOIA project intends to make significant new advances in silicon photonic integrated circuits by heterogeneously integrating novel III-V materials, namely quantum dot and quantum dash-based materials on silicon wafers, through wafer bonding. Thanks to the superior properties of those innovative materials, hybrid III-V lasers with better thermal stability, higher modulation bandwidth and the possibility of generating a flat wavelength-division-multiplexing comb will be demonstrated. Moreover, the hybrid integration of nano-structured materials on Si allows to exploit the advantages provided by silicon. In particular, optical filters can be directly integrated with hybrid quantum dot/quantum dash/Si lasers to create chirp-managed lasers, which have an enhanced modulation bandwidth and extinction ratio compared to directly modulated lasers. As an illustration of the technology developed in SEQUOIA, transmitters with a total capacity of 400 Gbit/s (16x25 Gbit/s) will be designed, fabricated and characterized. The hybrid integration of nano-structured III-V materials in silicon through a wafer bonding technique is generic, and the concepts and technology developed inside the SEQUOIA project can be further extended to other types of transmitters, for example with extended link range, higher bit rate, higher WDM channel number and other types of modulation formats. In addition, a broad range of applications, such as sensing, health-care, safety and security, can benefit from the technology developed in SEQUOIA.The SEQUOIA consortium is highly complementary, covering all skills required to achieve the project objectives, from the growth of the nano-structured materials to the assessment of high bit rate digital communication systems, and has the potential to set up a comprehensive supply chain for the future exploitation.
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Coordinator

III-V LAB

Address

1 Avenue Augustin Fresnel Campus Polytechnique
91767 Palaiseau Cedex

France

Activity type

Higher or Secondary Education Establishments

EU Contribution

€ 832 427

Administrative Contact

Denis MAZEROLLE (Dr.)

Participants (5)

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UNIVERSITAET KASSEL

Germany

EU Contribution

€ 593 314

INNOLUME GMBH

Germany

EU Contribution

€ 497 300

DANMARKS TEKNISKE UNIVERSITET

Denmark

EU Contribution

€ 387 613

COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

France

EU Contribution

€ 835 386

UNIVERSITE DE RENNES I

France

EU Contribution

€ 183 960

Project information

Grant agreement ID: 619626

Status

Closed project

  • Start date

    1 October 2013

  • End date

    30 September 2017

Funded under:

FP7-ICT

  • Overall budget:

    € 5 012 778

  • EU contribution

    € 3 330 000

Coordinated by:

III-V LAB

France