Obiettivo Project OMAN has the following objectives: - To establish a common 'core' OEIC chip manufacturing process having reproducible yield.- To establish a rugged, low cost interfacing/package technology for future use in European foundries.- To demonstrate the capability of higher functionality components in relation to more advanced implementations of optical termination and cross-connect units for IBC.- To demonstrate OEIC capabilities, and assess their suitability as IBC network elements, leading to standardisation.The research had the following objectives:to establish a common core optoelectronic integrated circuit (OEIC) chip manufacturing process having reproducible yield;to establish a rugged. Low cost interfacing and package technology for future use in European foundries;to demonstrate the capability of higher functionality components in relation to more advanced implementations of optical termination and cross connect units for integrated broadband communications (IBC);to demonstrate OEIC capabilities and assess their suitability as IBC network elements, leading to standardization.The research has resulted in the following:the definition of the application areas for OEIC's within the access network from a system stand point;the specification and design of critical integrable subcomponents for OEIC circuits planned for fabrication on the project;progress towards rationalization of OEIC chip fabrication process and packaging;fabrication of the first demonstration OEIC chip, incorporating a distributed feedback (DFB) laser diode, monitor diode, 3 dB coupler and wavelength division multiplexing (WDM) monolithically integrated on a semiinsulating substrate;the realization of an OEIC module demonstrator based on the system requirements of a single fibre customer and designed to operate as a subscriber or head end optical line termination unit for a passive optical network;the definition a generic set of optoelectronic modules with complementary functionality and standard defined interfaces for use within the integrate broadband communications network (IBCN).Technical Approach Project OMAN builds on demonstrators produced for RACE I by refining the OEIC manufacturing process to enable this technology to be used in early realisations of IBC. In parallel, the project pursues standardisation of optics within the IBC access network and plays a full part in the on-going network definition activities of RACE II. The project reviews in detail the emerging capabilities of OEIC technology against identified application requirements with respect to performance, cost and functionality. The processes for design and construction of OEIC devices (as complete packaged modules) are being progressively developed towards defined targets for yield and device integrity. Yield data will be used to develop cost projections and establish the economic case for OEIC technology in the access network. Five prototype module demonstrators and a WDM system demonstrator will be produced and evaluated by the partners within OMAN and by other RACE network projects. Project outputs from OMAN are submitted for inclusion in CFSs and CPRs. Key Issues - To demonstrate the advantages of InP based opto-electronics and optical signal processing.- The contribution that realisable OEIC technology may make to IBC network definition and standardisation.- Developments in network interface functionality, wavelength allocation, economics of fibre access, and advanced equipment practices. Expected Impact The expected benefits of opto-electronic integration within termination and interconnection equipment have been identified as low cost volume manufacture, and increased performance and functionality. Project OMAN will serve to establish this technology through collaboration on a European basis, and prepare a group of European industrial foundries to exploit the technology. The main impact of OEIC's will arise from realisation of cost advantages in equipment manufactured using these devices. Campo scientifico engineering and technologymechanical engineeringmanufacturing engineeringnatural sciencesphysical scienceselectromagnetism and electronicsoptoelectronicssocial scienceseconomics and businesseconomicsengineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsignal processingengineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationstelecommunications networksoptical networks Programma(i) FP3-RACE 2 - Specific research and technological development programme (EEC) in the field of communication technologies, 1990-1994 Argomento(i) Data not available Invito a presentare proposte Data not available Meccanismo di finanziamento Data not available Coordinatore GEC Marconi Materials Technology Ltd Contributo UE Nessun dato Indirizzo Caswell NN12 8EQ Towcester Regno Unito Mostra sulla mappa Costo totale Nessun dato Partecipanti (7) Classifica in ordine alfabetico Classifica per Contributo UE Espandi tutto Riduci tutto BT&D Technologies Ltd Regno Unito Contributo UE Nessun dato Indirizzo Whitehouse Road IP1 5PB Ipswich Mostra sulla mappa Costo totale Nessun dato GPT Ltd Regno Unito Contributo UE Nessun dato Indirizzo Technology Drive NG9 1LA Beeston Mostra sulla mappa Costo totale Nessun dato LISBON TECHNICAL UNIVERSITY I.S.T. Portogallo Contributo UE Nessun dato Indirizzo AV. ROVISCO PAIS 1096 LISBOA CODEX Mostra sulla mappa Costo totale Nessun dato NED.PHILIPS BEDRIJVEN BV Paesi Bassi Contributo UE Nessun dato Indirizzo PROF. HOLSTLAAN 4, 5656 AA EINDHOVEN 5656 AA Eindhoven Mostra sulla mappa Costo totale Nessun dato SIEMENS AG Germania Contributo UE Nessun dato Indirizzo OTTO-HAHN-RING 6 81739 MÜNCHEN Mostra sulla mappa Costo totale Nessun dato TELEFONICA I.R.D. Spagna Contributo UE Nessun dato Indirizzo EMILIO VARGAS 6 28043 MADRID Mostra sulla mappa Costo totale Nessun dato UNIVERSITY OF DELFT Paesi Bassi Contributo UE Nessun dato Indirizzo Mostra sulla mappa Costo totale Nessun dato
