Objectif The advent of (very) high bitrate services, the availability of high bandwidth transmission systems, and the advantage of ATM statistical mulitplexing gain offered by Gbit/s switches, raise the need for high speed switching and make the exploitation of advanced system concepts and technological advances inevitable. The first objective of the project is to study the feasibility of 2.4 Gbit/s ATM switching based on the ROXANNE Multi Path Self Routing switching principle. The second objective is the demonstration of the possibilities of a new electro-optical interconnection technology to solve the interconnection problems inside broadband exchanges.The main objectives of the research were:demonstration of asynchronous (ATM) switching at 2.4 gigabits per second based on the ROXANNE multipath selfrouting switch;demonstration of the potential of a new electrooptical interconnection technology to solve interconnection problems inside broadband exchanges.Key issues in the research include:high speed and high density digital signal processing;high speed and high density interconnection and packaging;precision mechanics for fibre to fibre and fibre to device alignment.Achievements of the research include:a feasibility study of 2.4 gigabits per second ATM switching based on the ROXANNE concept has been completed, down to the level of chip partitioning;Research on electrooptical board technology, multifibre packaging, and multifibre connector proceeds as scheduled.Technical Approach The study of 2.4 Gbit/s ATM switching is be based on the switching fabric developed for the RACE 1022 (RATT) demonstrator, and on the use of a new 2.4 Gbit/s line termination card. The RATT demonstrator is capable of switching ATM connections at speeds up to 155 or 622 Mbit/s. However, the switching fabric of the RATT can also accommodate higher external link speeds. Indeed, the multiple path characteristic of the switching fabric implies there is no rigid relation between the external link bitrate and the internal speed of operation of the elements of the switching fabric. To solve the high speed and high density interconnection problems inside broadband exchanges, an advanced electro-optical interconnection concept is being developed. Using discrete wiring technology, glass optical fibres are embedded in multilayer laminate substrates to realise electro-optical boards and back panels. The board technology is completed by the development of multi-fibre packages, electro-optical surface mount assembly techniques, a high density board to ribbon cable and board to back panel optical connector. The feasibility of fibre in board parallel optical links was shown in a working demonstrator. In the extension of the project, the manufacturability of the optical interconnection concept is studied. Micro-machining is used for the fabrication of multi-fibre alignment parts. A hands-free backpanel connector is being developed. Key Issues - High speed and high density digital signal processing.- High speed and high density interconnection and packaging.- Precision mechanics for fibre-to-fibre and fibre-to-device alignment. Expected Impact - Pulling forward the introduction of broadband services in Europe by reduction of the cost per unit of bandwidth. Due to ATM statistical multiplexing gain, a switch at 2.4 Gbit/s can handle considerably more traffic than 4 switches at 600 Mbit/s or 16 switches at 150 Mbit/s.- Increased interest in broadband ATM switching through its application to single services having bit rates up to 2.4 Gbit/s.- Electro-optical interconnection technology should facilitate cost-competitive solutions for the implementation of large broadband switches, based on the combination of optical interconnections and electronic logic. Champ scientifique engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsignal processingengineering and technologymaterials engineeringnatural sciencesphysical sciencesopticsfibre optics Programme(s) FP3-RACE 2 - Specific research and technological development programme (EEC) in the field of communication technologies, 1990-1994 Thème(s) Data not available Appel à propositions Data not available Régime de financement Data not available Coordinateur ALCATEL BELL Contribution de l’UE Aucune donnée Adresse F.wellesplein 1 2018 Antwerpen Belgique Voir sur la carte Coût total Aucune donnée Participants (9) Trier par ordre alphabétique Trier par contribution de l’UE Tout développer Tout réduire ALCATEL ALSTHOM RECHERCHE France Contribution de l’UE Aucune donnée Adresse Route de nozay 91460 Marcoussis Voir sur la carte Coût total Aucune donnée Alcatel SEL AG Allemagne Contribution de l’UE Aucune donnée Adresse Lorenzstraße 10 70435 Stuttgart Voir sur la carte Coût total Aucune donnée Alcatel SEL AG Allemagne Contribution de l’UE Aucune donnée Adresse Lorenzstraße 10 70435 Stuttgart Voir sur la carte Coût total Aucune donnée BT&D Technologies Ltd Royaume-Uni Contribution de l’UE Aucune donnée Adresse Whitehouse road IP1 5PB Ipswich Voir sur la carte Coût total Aucune donnée BT&D Technologies Ltd Royaume-Uni Contribution de l’UE Aucune donnée Adresse Whitehouse road IP1 5PB Ipswich Voir sur la carte Coût total Aucune donnée Corona Cinematografica Italie Contribution de l’UE Aucune donnée Adresse Strada lombardore 256 10040 Leini torino Voir sur la carte Coût total Aucune donnée FRAMATOME CONNECTORS BELGIUM N.V. Belgique Contribution de l’UE Aucune donnée Adresse A. spinoystraat 8 2800 Mechelen Voir sur la carte Coût total Aucune donnée IMEC Belgique Contribution de l’UE Aucune donnée Adresse Kapeldreef 75 3001 Leuven Voir sur la carte Coût total Aucune donnée INSTITUT FUER MIKROTECHNIK MAINZ GMBH Allemagne Contribution de l’UE Aucune donnée Adresse Carl-zeiss-strasse 18-20 55129 Mainz Voir sur la carte Coût total Aucune donnée