Objectif POPCORN aims to develop low cost high performance polymeric passive components for single mode optical networks. In particular, fully packaged power splitters are expected to be fabricated by mass production techniques, and implemented for CPN experiments. A new technology for hybrid integration of InP based devices and polymeric waveguide structures is to be demonstrated by a hybrid integrated leaky wave photodetector device.The main aim of the research is to develop low cost and high performance polymeric passive components for single mode optical networks. In particular, fully packaged power splitters, star couplers and wavelength multiplexers are expected to be realised and implemented for customer premises network (CPN) experiments.The technical approach utilising the high quality of photonic polymers and the mass production capabilities of polymers (eg injection moulding) or reaction moulding together with electroplating replication techniques for the fabrication of high precision metal moulds. In addition, this technology allows the simultaneous fabrication of guided wave structures together with fibre alignment grooves on the same substrate.The technological basis of the project is the fabrication of high precision metal moulds of wave guide structures and fibre alignment grooves for the implementation in, injection moulding machines. The metal moulds are realised by electroplating micromachined silicon masterstructures.Technical Approach POPCORN will achieve the goal of low cost passive components for optical networks by utilising the high quality of photonic polymers, the mass production capabilities of polymers (injection moulding and reaction casting) together with electroplating replication techniques for the fabrication of high precision metal moulds. This technology allows the simultaneous fabrication of guided wave structures together with fibre alignment grooves on the same substrate. The technological basis of the project is the fabrication of high precision metal moulds comprising waveguide structures and fibre alignment grooves, moulding techniques for polymeric substrate fabrication and passive alignment schemes for fibre and semiconductor chip alignment. The metal moulds are realised by electroplating of micromachined silicon or PMMA structures, which are generated by UV-light or X-ray lithography. Key Issues - Development of low loss photonic polymers suitable for the mass production of waveguide substrates and waveguide cores.- Development of mass production technologies for the simultaneous fabrication of waveguide structures and fibre alignment grooves.- Development of reliable and economic interfacing between waveguides and fibres with passive fibre alignment.- Hybrid integration of InP leaky wave detectors by passive alignment schemes.- Development of low cost and environmentally stable packages.- Cost analysis. Expected Impact The impact of the project on the future IBC network will be a substantial cost reduction of passive optical components like power splitters and hybrid integrated optical components comprising InP chips. This will lead to an economically justified introduction of these components in CPN's, which will greatly increase the flexibility, efficiency and the performance of IBC systems. It is expected, that the fabrication technology to be developed may be equally applied to the fabrication of opto-electric and nonlinear polymeric devices. Champ scientifique engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensorsoptical sensorsnatural scienceschemical sciencespolymer sciencesengineering and technologyelectrical engineering, electronic engineering, information engineeringinformation engineeringtelecommunicationstelecommunications networksoptical networksnatural sciencesphysical scienceselectromagnetism and electronicssemiconductivitynatural scienceschemical sciencesinorganic chemistrymetalloids Programme(s) FP3-RACE 2 - Specific research and technological development programme (EEC) in the field of communication technologies, 1990-1994 Thème(s) Data not available Appel à propositions Data not available Régime de financement Data not available Coordinateur ROBERT BOSCH GMBH Contribution de l’UE Aucune donnée Adresse ROBERT BOSCH STRASSE 200 31139 HILDESHEIM Allemagne Voir sur la carte Coût total Aucune donnée Participants (5) Trier par ordre alphabétique Trier par contribution de l’UE Tout développer Tout réduire AKZO CORPORATE RESEARCH Pays-Bas Contribution de l’UE Aucune donnée Adresse VELPERWEG 76 6800 SB ARNHEM Voir sur la carte Coût total Aucune donnée FACULD. DE CIENC. UNIVERSIDADE DO PORTO Portugal Contribution de l’UE Aucune donnée Adresse P. GOMES TEIXEIRA 4000 PORTO Voir sur la carte Coût total Aucune donnée MICROPARTS GMBH Allemagne Contribution de l’UE Aucune donnée Adresse HAUERT 7 44227 DORTMUND Voir sur la carte Coût total Aucune donnée QUANTE AG Allemagne Contribution de l’UE Aucune donnée Adresse ÜLLENDAHLER STRAßE 353 5600 WUPPERTAL Voir sur la carte Coût total Aucune donnée Universität Dortmund Allemagne Contribution de l’UE Aucune donnée Adresse Otto-Hahn-Straße 6 44227 Dortmund Voir sur la carte Coût total Aucune donnée