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Multi-Gigabit, Scalable & Energy Efficient on-board Digital Processors Employing Multi-core, Vertical, Embedded Opto-electronic Engines

Multi-Gigabit, Scalable & Energy Efficient on-board Digital Processors Employing Multi-core, Vertical, Embedded Opto-electronic Engines

Objective

New multi-beam Tera-scale capacity satellites will require a disruptive approach to address digital on-board processors that rely on electronics which consume space, power and cost and reach their capacity saturation. The disruptive solution must combine scalability, technical feasibility, power-efficiency and cost-effectiveness. ROBIN aims to provide this solution realizing multi-gigabit optical inter-connectivity with a unique combination of low-power and high-bandwidth multimode (MM) GaAs VCSEL/PDs, low power, radiation-hardened BiCMOS drivers and radiation-hardened multi-core fibers (MCFs). ROBIN will integrate these technologies on a space grade photonic integration capable to provide ruggedized transceiver modules with a record-high 150Gb/s throughput and 6mW/ Gb/s energy consumption which is a 3-fold improvement against state-of-the-art (SOTA) US-based products. ROBIN will fabricate the first >15GHz MCF-matched 850nm VCSELs operating at -40 to +100 oC and will drive energy consumption down to <200 fJ/bit (0.2 mW/Gb/s). ROBIN will demonstrate the first >30 GHz MM MCF-PDs with >0.6A/W responsivity. ROBIN will couple MCF-VCSELs/PDs to the first 6-core radiation-hard MM-MCF to offer the capability for single-feedthrough robust and hermetic module packaging. Fibers will be distributed through a monolithic fan-out avoiding the use and procurement of expensive connectors. ROBIN will develop the first 25 Gb/s 6-channel, driver/TIA ICs with record-low <2pJ/bit energy consumption in a 5-fold decrease against SOTA products. ICs will be fabricated with IHP 0.25μm SiGe BiCMOS process which is under ESA qualification. ROBIN will fabricate an opto-electronic 6x25 Gb/s capable ADC/DAC module using MCF optical interfaces and will test it in a full-scale optical interconnect breadboard demonstrator. Finally, ROBIN will perform space assessment tests on all the components to align development towards a European space qualifiable system.
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Coordinator

Gooch & Housego (Torquay) Limited

Address

Broomhill Way Unit A
Tq2 7ql Torquay Devon

United Kingdom

Activity type

Other

EU Contribution

€ 472 993

Administrative Contact

Leontios Stampoulidis (Dr)

Participants (7)

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THALES ALENIA SPACE FRANCE

France

EU Contribution

€ 140 335

Philips GmbH

Germany

EU Contribution

€ 265 000

OFS FITEL DENMARK APS

Denmark

EU Contribution

€ 223 545

IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ-INSTITUT FUER INNOVATIVE MIKROELEKTRONIK

Germany

EU Contribution

€ 441 902

Teknologian tutkimuskeskus VTT Oy

Finland

EU Contribution

€ 520 906

CHALMERS TEKNISKA HOEGSKOLA AB

Sweden

EU Contribution

€ 390 230

CONSTELEX TECHNOLOGY ENABLERS SINGLE MEMBER LIMITED LIABILITY COMPANY

Greece

EU Contribution

€ 44 087

Project information

Grant agreement ID: 607274

Status

Closed project

  • Start date

    2 October 2013

  • End date

    2 June 2017

Funded under:

FP7-SPACE

  • Overall budget:

    € 3 746 639,50

  • EU contribution

    € 2 498 998

Coordinated by:

Gooch & Housego (Torquay) Limited

United Kingdom