CORDIS
EU research results

CORDIS

English EN
Modelling Reliability under Variability

Modelling Reliability under Variability

Objective

While feature sizes are continuously scaled towards atomic dimensions, industry is increasingly confronted with unexpected physical artefacts to be considered at each new technology node. Among these, process variation and parameter degradation lead to reliability concerns impacting integrated circuit design at all abstraction levels. As variation and degradation may become a limiting factor for future scaled technologies, there has been a tremendous research effort in understanding these artefacts. Versatile tools, allowing consideration of these artefacts and their combined impact during the design of ICs are still in their infancy. Rather than developing yet another design support methodology, we aim to combine and refine existing reliability and variability prediction methodologies at the abstraction layers with highest industrial importance: Register transfer (RT) level - usual design entry, gate level – where most design for reliability (DfR) techniques are applied, and transistor level - where final sign-off is made.MoRV will cover the strong relationship between variability and ageing, which are usually treated separately, fostering the idea of treating ageing as a form of time-dependent variability. Combined models from transistor, over gate, to RT level will be characterized directly from silicon measurement and all models will be able to interpret the same characterization data base from the silicon measurement.The results will be introduced into a reference design flow combined with a multi-level multi-physics engine. Final goal of MoRV is to enable automated synthesis from specification to circuit. Each model layer will offer reliability and variation prediction for typical and worst case scenarios in order to assess the effectiveness of available design techniques.
Leaflet | Map data © OpenStreetMap contributors, Credit: EC-GISCO, © EuroGeographics for the administrative boundaries

Coordinator

OFFIS EV

Address

Escherweg
26121 Oldenburg

Germany

Administrative Contact

Frank Oppenheimer (Dr.)

Participants (6)

Sort alphabetically

Expand all

GLOBAL TCAD SOLUTIONS GMBH

Austria

TECHNISCHE UNIVERSITAET WIEN

Austria

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM VZW

Belgium

FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V

Germany

INFINEON TECHNOLOGIES AG

Germany

IROC TECHNOLOGIES SA

France

Project information

Grant agreement ID: 619234

  • Start date

    1 January 2014

  • End date

    31 December 2016

Funded under:

FP7-ICT

  • Overall budget:

    € 4 159 110

  • EU contribution

    € 3 058 000

Coordinated by:

OFFIS EV

Germany