Objective
The LOMID project will define pathways to the manufacture of flexible OLED microdisplays with an exceptionally large area (16 mm x 20 mm, screen diagonal of 25.4 mm) at acceptably high yields (>65%).
This will be achieved by developing a robust silicon-based chip design allowing high pixel counts (1024x1280 (SXGA)) and high spatial resolution(pixel sizes of 10 µm x 10 µm corresponding to 2000 ppi). These display innovations will be coupled to a highly reliable manufacturing of the backplane. Cheap processes (e.g. based on 0.35 µm lithography) will be developed and special attention will be given to the interface between the top metal electrode of the CMOS backplane and the subsequent OLED layers. All these developments will be done on a 200 mm wafer scale. Along with this, a new testing procedure for quality control of the CMOS wafer (prior to OLED deposition) will be developed and promoted for standardisation.
The flexibility of the large area microdisplays will be achieved by wafer thinning to enable a bending radius of 45 mm. Along with the new functionality, the durability of the devices has to be guaranteed despite bending to be comparable to rigid devices. The project will address this by improving the OLED efficiency (e.g. operating lifetime > 15,000 hours) and by modifying the device encapsulation to both fulfil the necessary barrier requirements (WVTR < 10^-6 g/d m2) and to give sufficient mechanical protection.
The demand for and timeliness of these flexible, large area microdisplays is shown by the strong interest of industrial integrators to demonstrate the benefits of the innovative OLED microdisplays. Within the project, industrial integrators will validate the project’s microdisplays in smart glasses for virtual reality and to aid those with impaired vision.
Fields of science
- natural scienceschemical sciencesinorganic chemistryinorganic compounds
- engineering and technologymaterials engineeringcoating and films
- natural sciencesphysical sciencesopticslaser physicspulsed lasers
- natural sciencescomputer and information sciencessoftwaresoftware applicationsvirtual reality
- natural scienceschemical sciencesinorganic chemistrymetalloids
Programme(s)
- H2020-EU.2.1.1. - INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT) Main Programme
- H2020-EU.2.1.1.1. - A new generation of components and systems: Engineering of advanced embedded and energy and resource efficient components and systems
Funding Scheme
RIA - Research and Innovation actionCoordinator
80686 Munchen
Germany
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Participants (10)
28029 Madrid
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
OX1 2JD Oxford
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04109 Leipzig
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01109 Dresden
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Legal entity other than a subcontractor which is affiliated or legally linked to a participant. The entity carries out work under the conditions laid down in the Grant Agreement, supplies goods or provides services for the action, but did not sign the Grant Agreement. A third party abides by the rules applicable to its related participant under the Grant Agreement with regard to eligibility of costs and control of expenditure.
93350 Kuching Sarawak
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Legal entity other than a subcontractor which is affiliated or legally linked to a participant. The entity carries out work under the conditions laid down in the Grant Agreement, supplies goods or provides services for the action, but did not sign the Grant Agreement. A third party abides by the rules applicable to its related participant under the Grant Agreement with regard to eligibility of costs and control of expenditure.
91100 Corbeil Essonnes Cedex
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38040 Grenoble Cedex 09
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
75015 Paris 15
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3125 Toffen
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
Participation ended
1184 Luins
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