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Thermally Integrated Smart Photonics Systems

Thermally Integrated Smart Photonics Systems

Objective

The objective of this proposal is to develop and demonstrate a scalable, thermally-enabled 3D integrated optoelectronic platform that can meet the explosion in data traffic growth within ICT. The Thermally Integrated Smart Photonics Systems (TIPS) program will heterogeneously integrate micro-thermoelectric coolers (μTEC) and micro-fluidics (μFluidics) with optoelectronic devices (lasers, modulators, etc.) in order to precisely control device temperature and thus device wavelength compared to commercially available discrete technology.
Data traffic is projected to increase sharply (40-80× by 2020) and this is driving an increase in network complexity and the requirement for scalable optoelectronic integration. A major bottleneck to this large scale integration is thermal management. Active photonic devices generate extremely high heat flux levels (~1 kW/cm2) that must be efficiently removed to maintain performance and reliability; furthermore, active photonic devices must be controlled at temperature precision better than ±0.1°C. Today’s thermal technology is at the limit and cannot scale with growth in the network. As a comparison, electronics produce lower heat flux levels (~100 W/cm2) and have a less restrictive temperature requirement of ≤ 85±2°C.
Integration of thermal management onto optoelectronic devices has not been addressed to date in academic or industrial investigations and therefore presents a significant knowledge gap that must be filled to enable impact and ensure the EU is at the forefront of optoelectronic technology. While the end goal is driven by telecom or datacom industrial requirements there are many scientific knowledge gaps that will be filled by the TIPS consortium. The application space for a thermally-integrated smart optoelectronic solution is large and spans multiple communication length scales from long reach to inter/ intrachip communications as well as other applications like sensors that seek to leverage silicon photonics platforms
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Coordinator

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK

Address

Western Road
T12 Yn60 Cork

Ireland

Activity type

Higher or Secondary Education Establishments

EU Contribution

€ 1 198 696

Participants (10)

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III-V LAB

France

EU Contribution

€ 794 850

NOKIA IRELAND LIMITED

Ireland

EU Contribution

€ 550 500

UNIVERSITAET HAMBURG

Germany

CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRS

France

EU Contribution

€ 741 500

UNIVERSITY OF LIMERICK

Ireland

EU Contribution

€ 471 708,75

LIONIX BV

Netherlands

LIONIX INTERNATIONAL BV

Netherlands

EU Contribution

€ 472 625

NOKIA BELL LABS FRANCE

France

EU Contribution

€ 367 002,50

COMMUNICRAFT LIMITED

Ireland

EU Contribution

€ 152 733,75

LEIBNIZ-INSTITUT FUER FESTKOERPER- UND WERKSTOFFFORSCHUNG DRESDEN E.V.

Germany

EU Contribution

€ 480 425

Project information

Grant agreement ID: 644453

Status

Closed project

  • Start date

    1 February 2015

  • End date

    31 July 2018

Funded under:

H2020-EU.2.1.1.1.

  • Overall budget:

    € 5 230 041,25

  • EU contribution

    € 5 230 041

Coordinated by:

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK

Ireland