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Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologies

Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologies

Objective

The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilot line between 2 companies:
- Soitec for the fabrication of advanced engineered substrates (UTBB: Ultra Thin Body and BOx (buried oxide)) without and with strained silicon top film.
- STMicroelectronics for the development and industrialization of state of the art FDSOI technology platform at 14nm and beyond with an industry competitive Power-Performance-Area-Cost (PPAC) trade-off.
The project represents the first phase of a 2 phase program aiming at establishing a 10nm FDSOI technology for 2018-19.
A strong added value network is created across this project to enhance a competitive European value chain on a European breakthrough and prepare next big wave of electronic devices. The consortium gathers a large group of partners: academics/institutes, equipment and substrate providers, semiconductor companies, a foundry, EDA providers, IP providers, fabless design houses, and a system manufacturer. E&M will contribute to the objective of installing a pilot line capable of manufacturing both advanced SOI substrates and FDSOI CMOS integrated circuits at 14nm and beyond. Design houses and electronics system manufacturer will provide demonstrator and enabling IP, to spread the FDSOI technology and establish it as a standard in term of leading edge energy efficient CMOS technology for a wide range of applications battery operated (consumer , healthcare, Internet of things) or not. Close collaboration between the design activities and the technology definition will tailor the PPAC trade-off of the next generation of technology to the applications needs.
Leaflet | Map data © OpenStreetMap contributors, Credit: EC-GISCO, © EuroGeographics for the administrative boundaries

Coordinator

STMICROELECTRONICS CROLLES 2 SAS

Address

Rue Jean Monnet 850
38920 Crolles

France

Activity type

Other

EU Contribution

€ 1 650 839,95

Participants (32)

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STMICROELECTRONICS GRENOBLE 2 SAS

France

STMICROELECTRONICS SA

France

EU Contribution

€ 708 501,81

COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

France

EU Contribution

€ 13 831 513,75

SOITEC SA

France

EU Contribution

€ 3 777 540,65

CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRS

France

EU Contribution

€ 594 996

SILTRONIC AG

Germany

EU Contribution

€ 168 564,69

GLOBALFOUNDRIES Dresden Module One LLC & Co. KG

Germany

EU Contribution

€ 244 805

DAINIPPON SCREEN DEUTSCHLAND GMBH

Germany

EU Contribution

€ 75 584,55

LAM RESEARCH AG

Austria

FEI ELECTRON OPTICS BV

Netherlands

EU Contribution

€ 259 898,60

UNIVERSITE CATHOLIQUE DE LOUVAIN

Belgium

EU Contribution

€ 84 906,25

HSEB DRESDEN GMBH

Germany

EU Contribution

€ 145 131,21

BRUKER AXS GMBH

Germany

EU Contribution

€ 694 160,32

PICOSUN OY

Finland

EU Contribution

€ 72 970,62

SOCIONEXT EUROPE GMBH

Germany

EU Contribution

€ 284 754,38

PRODRIVE TECHNOLOGIES BV

Netherlands

EU Contribution

€ 113 750

APPLIED MATERIALS FRANCE

France

EU Contribution

€ 60 519

EV GROUP E. THALLNER GMBH

Austria

EU Contribution

€ 534 464,45

NOVA MEASURING INSTRUMENTS LTD

Israel

EU Contribution

€ 247 812,50

ALCATEL-LUCENT DEUTSCHLAND AG

Germany

EU Contribution

€ 66 375,26

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Germany

EU Contribution

€ 1 289 579,20

SONY DEUTSCHLAND GMBH

Germany

EU Contribution

€ 129 200

INSTITUT POLYTECHNIQUE DE GRENOBLE

France

EU Contribution

€ 64 526,05

UNIVERSIDAD DE GRANADA

Spain

EU Contribution

€ 48 750

MUNEDA GMBH

Germany

EU Contribution

€ 113 442,42

HQ-Dielectrics GmbH

Germany

EU Contribution

€ 98 628,20

Gold Standard Simulations ltd

United Kingdom

EU Contribution

€ 37 816,80

GLOBAL TCAD SOLUTIONS GMBH

Austria

EU Contribution

€ 98 820,15

LAM RESEARCH SAS

France

EU Contribution

€ 99 009,95

TOKYO ELECTRON EUROPE LIMITED

United Kingdom

ISD LYSEIS OLOKRIROMENON SYSTIMATONANONYMOS ETAIREIA

Greece

EU Contribution

€ 132 234,38

SYNOPSYS (NORTHERN EUROPE) LIMITED

United Kingdom

EU Contribution

€ 67 483,20

Project information

Grant agreement ID: 662175

Status

Closed project

  • Start date

    1 May 2015

  • End date

    31 December 2017

Funded under:

H2020-EU.2.1.1.7.

  • Overall budget:

    € 99 399 264,13

  • EU contribution

    € 25 796 579,34

Coordinated by:

STMICROELECTRONICS CROLLES 2 SAS

France