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Extended Image Sensing Technologies

Fact Sheet

Result in Brief

Reporting

Results

Project information

EXIST

Grant agreement ID: 662222

Project website

Status

Closed project

Start date

1 May 2015
End date

31 December 2018

Funded under:

H2020-EU.2.1.1.7.

Overall budget:

€ 26 802 872,75
EU contribution

€ 8 575 964,15

Coordinated by:

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Belgium

Objective

This project will research new technologies for CMOS image sensors that are needed in the next generation of several application domains.
The image sensor research will focus on enhancing the capabilities of current imaging devices:
• New design (architectures) and technology (e.g. 3D stacking) for better pixels (lower noise, higher dynamic range, new functionality within the pixel) and more pixels (higher spatial and temporal resolutions) at higher speed, time-of-flight pixels, local (on-chip) image processing, embedded CCD in CMOS TDI pixels.
• Extended sensitivity and functionality of the pixels: extension into infrared, filters for hyper-and multi-spectral imaging, better colour filters, programmable filters with LCD cells.

Application domains that will be covered are:
• Digital Lifestyle: Broadcast, Digital Cinema & Entertainment, Smart home (Grass Valley, Angenieux, Silios, Delft University of Technology, SoftKinetic)
• Smart Production (IMEC, C-cam)
• High-end Security (Adimec, Angenieux, Le2i, TNO)
• Agriculture and food sorting using hyper- and multi-spectral imaging and programmable filters (Silios, Le2i)
• Medical healthcare: diagnostics using multi-/hyper-spectral imaging and programmable filters (Adimec, TNO, Silios, Quest and Focal)
• Gas detection using multi spectral IR imagers (Sofradir)
• Security: gas sensing (Sofradir)

The prototype CMOS image sensors for several application domains will be demonstrated together with the sensor related processing.

Field of Science

/humanities/arts/modern and contemporary art/film

/agricultural sciences/agriculture, forestry, and fisheries

/agricultural sciences/agriculture, forestry, and fisheries/agriculture

/engineering and technology/civil engineering/architecture engineering/home automation

/engineering and technology/environmental engineering/energy and fuels/fossil energy/gas

Programme(s)

H2020-EU.2.1.1.7. - ECSEL

Topic(s)

ECSEL-01-2014 - ECSEL Key Applications and Essential Technologies (RIA)

Call for proposal

ECSEL-2014-1

See other projects for this call

Funding Scheme

ECSEL-RIA - ECSEL Research and Innovation Action

Coordinator

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Address

Kapeldreef 75
3001 Leuven

Belgium

Activity type

Research Organisations

EU Contribution

€ 3 403 532

Website

Contact the organisation

Participants (18)

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IMINDS

Belgium

GRASS VALLEY NEDERLAND BV

Netherlands

EU Contribution

€ 1 007 256,25

ADIMEC ADVANCED IMAGE SYSTEMS BV

Netherlands

EU Contribution

€ 723 125

NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO

Netherlands

EU Contribution

€ 306 348,25

TECHNISCHE UNIVERSITEIT DELFT

Netherlands

EU Contribution

€ 142 795,25

AMS SENSORS BELGIUM

Belgium

EU Contribution

€ 667 341

SOFTKINETIC SOFTWARE

Belgium

SONY DEPTHSENSING SOLUTIONS

Belgium

EU Contribution

€ 427 265,31

SOFTKINETIC SENSORS NV

Belgium

ISD LYSEIS OLOKRIROMENON SYSTIMATONANONYMOS ETAIREIA

Greece

EU Contribution

€ 229 531,25

LYNRED

France

EU Contribution

€ 130 273,89

UNIVERSITE DIJON BOURGOGNE

France

EU Contribution

€ 202 948

THALES LAS FRANCE SAS

France

EU Contribution

€ 717 267,20

THALES ANGENIEUX SAS

France

SILIOS TECHNOLOGIES SA

France

EU Contribution

€ 187 688

DEMCON FOCAL BV

Netherlands

EU Contribution

€ 120 961

QUEST PHOTONIC DEVICES BV

Netherlands

EU Contribution

€ 231 643,75

VECTOR INTERNATIONAL

Belgium

EU Contribution

€ 77 988

Project information

EXIST

Grant agreement ID: 662222

Project website

Status

Closed project

Start date

1 May 2015
End date

31 December 2018

Funded under:

H2020-EU.2.1.1.7.

Overall budget:

€ 26 802 872,75
EU contribution

€ 8 575 964,15

Coordinated by:

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Belgium

This project is featured in...

RESEARCH*EU MAGAZINE

How tech is taking on terrorism

Issue 87, November 2019

Project information

EXIST

Grant agreement ID: 662222

Project website

Status

Closed project

Start date

1 May 2015
End date

31 December 2018

Funded under:

H2020-EU.2.1.1.7.

Overall budget:

€ 26 802 872,75
EU contribution

€ 8 575 964,15

Coordinated by:

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

DE EN ES FR IT PL

New sensors usher in next-generation vision systems in security, medicine and automotive applications

Demand for image sensors in automobiles, the Internet of Things, medicine or security and surveillance applications is challenging businesses to improve the performance of their integrated systems. An EU-funded project developed breakthrough image sensors that should expand the functionality of future vision systems.

The next generation of camera systems entering the market after five years will rely entirely on novel cutting-edge technologies. With this in mind, the EU-funded project EXIST investigated and developed new technologies for image sensors and systems for future applications. The new solutions combine high performance in terms of speed, compactness, band selection and cost. Image sensor combines the best of different worlds Time delay and integration (TDI) is an imaging technique used when an object or scene is moving linearly over an imager and when the content of the scene is not changing within a short period of time. The technology of choice for handling analogue TDI pixel data is charge-coupled-device (CCD) technology. Applications mainly include industrial inspection, life sciences and machine vision. Project partners have developed a new solution that combines CCD TDI pixels together with advanced complementary metal-oxide-semiconductor (CMOS) drivers and readout in one single chip, enabling a single imager chip with both CCD and CMOS functionality. “This unique technology combines the noiseless collection and transfer in charge domain of the CCD technology, and the system integration potential and fast readout that only CMOS can deliver,” notes Piet De Moor, business developer at IMEC. Other high-resolution sensors A new 4K sensor has been developed together with the image processing chain for 4K. This work resulted in the launch of the LDX86N broadcast camera product. Two other high-resolution sensors were also built: a 32MP sensor and a 14MP sensor. A rugged UHDTV zoom lens and digital hardware image processing in FPGA were developed for high-resolution image processing. Multiple products are already or will soon be on the market such as the new 4K broadcasting camera, full frame cinema zoom lens, 4K and 8K UHDTV small outline cameras for security and industrial vision, the new 14Mp global shutter imager for industrial vision, and the new high-speed multi-band TDI imager. Compact high-resolution cameras and sensors can be used in security applications or machine vision. “Enhancements in broadcasting are obvious in our evolving quest for better TV resolution,” notes De Moor. Back-side illumination for maximum sensitivity The vast majority of image sensors are designed to convert the light falling on the front side of the sensor to electrons. Recent design breakthroughs in the arrangement of imaging elements have made back-illuminated image sensors increase the amount of light that is captured, leading to improved low-light performance. Capitalising on the latest advances, project partners developed hyperspectral filter structures processed at wafer-level on commercially available image sensor wafers. These filters can be added for increasing TDI imaging performance. Combining colour and near-infrared imaging EXIST also introduced a new time-of-flight image sensor combining RGB colour filters and narrow-band near-infrared filters. This breakthrough optical filter integration platform will enable many applications in fields ranging from medical, industrial, security surveillance and automotive areas to virtual and augmented reality, where near-infrared signals need to be extracted and overlaid on top of colour images. Project partners have already unveiled a multispectral filter stack combining near-infrared and visual light on an imager for use in laparoscopy. By introducing new technologies based on innovative materials, designs and concepts into image sensor process technology, EXIST will promote a growing market share, increase employment and investment in innovative equipment, materials and semiconductor device manufacturing.

Keywords

EXIST, image sensor, security, time delay and integration (TDI), charge-coupled-device (CCD), complementary metal-oxide-semiconductor (CMOS), near-infrared, laparoscopy, Internet of Things, machine vision

Project information

EXIST

Grant agreement ID: 662222

Project website

Status

Closed project

Start date

1 May 2015
End date

31 December 2018

Funded under:

H2020-EU.2.1.1.7.

Overall budget:

€ 26 802 872,75
EU contribution

€ 8 575 964,15

Coordinated by:

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

This project is featured in...

RESEARCH*EU MAGAZINE

How tech is taking on terrorism

Issue 87, November 2019

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Project information

EXIST

Grant agreement ID: 662222

Project website

Status

Closed project

Start date

1 May 2015
End date

31 December 2018

Funded under:

H2020-EU.2.1.1.7.

Overall budget:

€ 26 802 872,75
EU contribution

€ 8 575 964,15

Coordinated by:

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Belgium

Periodic Reporting for period 3 - EXIST (Extended Image Sensing Technologies)

Reporting period: 2017-05-01 to 2018-12-31

Summary of the context and overall objectives of the project

• The Exist project addresses the need for improved and advanced image capturing techniques and further explores the potential of these. Applicable in multiple domains of the society like agriculture, healthcare, broadcast, security ...
• A first objective of the project is to increase the resolution of imaging systems. Higher resolution images give sharper detail in e.g. broadcast TV, in surveillance cameras, in industrial inspection cameras etc. Image sensors are built for 4K UHD imaging and a broadcast camera with this sensor was introduced on the market during this project. A large format 32Mpixel sensor has been built and experimented and a 14Mpixel sensor was built for industrial and security applications. All system components to support such high resolution were developed like high resolution zoom lenses, image processing SW for image improvement (de-noising, lens-aberration correction, demosaicing etc) and all HW to support the high-resolution image data streams.
• A second objective was to improve Time-of-flight imaging systems. A specific research domain is the development of an image capturing system that combines colour images and depth sensing to build compact systems (e.g. for VR and AR applications). SDS did build a dedicated image sensor with mosaic pixel layout. Commercially-available RGB filters were deposited onto the pixels with colour functionality and a NIR filter was deposited by IMEC, on the pixels with depth sensing functionality. Image data processing including novel demosaicing and colour correction was added. The resulting system has been successfully built and demonstrated in a VR game application.
• As a third objective, hyperspectral imaging was investigated and brought to a next level from technology to applications. Several application areas learned how to benefit of hyperspectral imaging by small systems based upon integrated image sensors. Hyperspectral image data capturing and processing were investigated in agriculture, medical, and security applications.
This research also indicated the limitations of hyperspectral imaging in terms of sensitivity in real application scenarios.
• As the last objective, a novel TDI image sensor has been built. This kind of imagers allows for image capturing at low light levels or at high speed and finds its typical application in e.g. space observation, inspection of e.g. pcb or flat panel A CCD-in-CMOS process is developed and improved. In this process a dedicated image sensor was designed to combine the benefits of CCD imaging with the on-chip read-out capabilities of CMOS to achieve a very fast TDI and even multispectral imager.

Work performed from the beginning of the project to the end of the period covered by the report and main results achieved so far

• High resolution image sensors have been built by Grass Valley and a 4K imager has been designed into a broadcast camera that is available on the market now. High resolution zoom lenses were designed and built by Thales-Angenieux for high-end security and broadcast applications and will be industrialized hereafter. AMS designed and produced a next generation high resolution image sensor for industrial vision and presented this at Vision 2018. High resolution imaging applications are supported by demosaicing, denoising and chromatic aberration correction SW developed in this project by Imec and Le2i. Adimec developed cameras for 4K UHDTV in small outline with low power and improved image processing for security applications addressing the market in a few years from now.
• Sony Depth Sensing Solutions, in cooperation with Imec, developed a new generation VR system and an application in gaming.
• Adimec in cooperation with Imec did build a compact size hyperspectral camera that was used by e.d. Demcon to enrich their portfolio of SW to evaluate hyperspectral data for applications in forensic diagnostic tools and industrial sorting.
Quest-Innovations did build an RGB/VIS/NIR camera on a surgical imaging system for laparoscopy.
Based on this camera, a demonstration system was built by TNO that classifies veins on a person’s arm to demonstrate feasibility of live tissue classification.
Ex-vivo tissue was used to generate an annotated dataset to train a classification algorithm to demonstrate the camera’s performance for classification of various tissue types, such as fat, muscle, veins, arteries, and organ sections.
• Le2i and Silios did build a sensor and one-shot multispectral camera for control and security access that will come to exploitation in a few years.
• Imec optimized the CCD-in-CMOS technology and finalized the development of a fast 7 band TDI imager.
Imec did build a demonstration system to show the capabilities of this technology and this novel imager and showed this at Vision 2018 and at Photonics West 2019. Imec offers this imager as evaluation samples today and is open to accept similar TDI imager design requests.

Progress beyond the state of the art and expected potential impact (including the socio-economic impact and the wider societal implications of the project so far)

• The results in high resolution imaging for ultra HD in broadcast represented for each of the building blocks a step beyond the state of the art and will soon be visible to the society in live television productions with improved resolution and image quality.
• The results in Si process development for CCD-in-CMOS and of the novel TDI image sensor are beyond the state of the art. This technology is replacing several traditional CCD components or will be used where traditional CCD components cannot reach the required speeds or complexity. The ideas for the process and imager are today taken over by at least 2 major players in the industry for applications in industrial inspection.
• The process technologies for multi spectral filters by colour shading or for hyperspectral filters on a BSI imager made significant process in this project. The project also enabled a number of partners to work in the new domain of compact hyperspectral imaging systems and to learn about the directions to be taken for future research work in the domain of medical care, forensic, agriculture and security applications.

project logo

Project information

EXIST

Grant agreement ID: 662222

Project website

Status

Closed project

Start date

1 May 2015
End date

31 December 2018

Funded under:

H2020-EU.2.1.1.7.

Overall budget:

€ 26 802 872,75
EU contribution

€ 8 575 964,15

Coordinated by:

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

This project is featured in...

RESEARCH*EU MAGAZINE

How tech is taking on terrorism

Issue 87, November 2019

Project information

EXIST

Grant agreement ID: 662222

Project website

Status

Closed project

Start date

1 May 2015
End date

31 December 2018

Funded under:

H2020-EU.2.1.1.7.

Overall budget:

€ 26 802 872,75
EU contribution

€ 8 575 964,15

Coordinated by:

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Belgium

Deliverables

Documents, reports (4)

Second Benchmarking report

First Benchmarking report

Public final evaluation results

o Censored version of deliverable D3.5, that can be published

Final Public Demonstrator Results

Shortened version of summary of the performance of all demonstrators to be published outside the consortium

Websites, patent fillings, videos etc. (1)

Publications

Conference proceedings (17)

CMOS Image Sensors: Masterpieces of 3D Integration

Author(s): Albert Theuwissen

Published in: Norwegian Electro-Optical meeting, 2016

A new way of seeing tissues

Author(s): Nanda van der Stap et al.

Published in: 24th International Congress of the European Association of Endoscopic Surgery, 2016

A first order analytical TOD sensor performance model

Author(s): Piet Bijl, Maarten A. Hogervorst

Published in: Electro-Optical and Infrared Systems: Technology and Applications XIII, Issue 9987, 2016, Page(s) 99870P

DOI: 10.1117/12.2242262

CMOS Image Sensors: Masterpieces of 3D Integration

Author(s): Albert Theuwissen

Published in: 6th Fraunhofer CMOS Image Sensor workshop, 2016

Goals and directions of the newly started EXIST project.

Author(s): Piet De Moor et al.

Published in: Advanced Concepts for Intelligent Vision Systems, 2015

EXIST project poster

Author(s): JU ECSEL office with input from Piet De Moor, IMEC

Published in: European Nanoelectronics Forum, 2015

A 7-band CCD-in-CMOS multispectral TDI imager

Author(s): David San Segundo Bello, Maarten De Bock, Pierre Boulenc, Roeland Vandebriel, Linkun Wu, Jan Van Olmen, Vezio Malandruccolo, Jan Craninckx, Luc Haspeslagh, Stefano Guerrieri, Maarten Rosmeulen, Jonathan Borremans

Published in: International Image Sensor Workshop 2017, 2017, Page(s) 129-132

Noise : You Love It or You Hate It

Author(s): Albert Theuwissen

Published in: ISSCC, 2016

HDR video synthesis for vision systems in dynamic scenes

Author(s): Shopovska, I. and Jovanov, L. and Goossens, B. and Philips, W.

Published in: Applications of Digital Image Processing XXXIX, Proceedings of SPIE Vol. 9971, 2016

CMOS-based hyperspectral imaging enabling innovation in health care, agriculture and food safety

Author(s): Jerome Baron

Published in: SPIE Industry Events at SPIE defense and commercial sensing, 2016

High-speed and TDI CMOS imagers for machine vision, life-sciences, remote sensing and scientific applications

Author(s): Jonathan Borremans

Published in: SPIE Industry Events at SPIE defense and commercial sensing, 2016

High speed TDI embedded CCD in CMOS sensor

Author(s): Pierre Boulenc, Jo Robbelein, Linkun Wu, Luc Haspeslagh, Piet De Moor, Jonathan Borremans, Maarten Rosmeulen

Published in: International Conference on Space Optics 2016 proceedings, Issue Every 2 years, 2016

Progress in sensor performance testing, modeling and range prediction using the TOD method: an overview

Author(s): Piet Bijl, Maarten A. Hogervorst, Alexander Toet

Published in: Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXVIII, Issue 10178, 2017, Page(s) 101780U

DOI: 10.1117/12.2266788

High speed backside illuminated TDI CCD-in-CMOS sensor

Author(s): Pierre Boulenc, Jo Robbelein, Linkun Wu, Vasyl Motsnyi, Luc Haspeslagh, Stefano Guerrieri, Jonathan Borremans, Maarten Rosmeulen

Published in: International Image Sensor Workshop 2017, 2017, Page(s) 364-367

Spectral imaging “Beyond Vision” and even “Beyond Silicon: High potential does EXIST!

Author(s): Fokko P. Wieringa

Published in: 2016

CMOS Image Sensors: Masterpieces of 3D integration

Author(s): Albert Theuwissen

Published in: Workshop Smart Sensors, Delft University of Technology, 2016

Copper Oxide Direct Bonding of 200mm CMOS Wafers with Five Metal Levels and TSVs: Morphological and Electrical Characterization

Author(s): C. Cavaco, L. Peng, S. Lavizzari, J. Claes, N. V. Hoovels, S. Guerrieri, D. S. Tezcan, and H. Osman

Published in: ECS Transastions 2016, Issue volume 75, issue 7, 2016, Page(s) 43-46

Other (11)

Ultimate earth observation using time delay integration line scan imagers using the CCD-in-CMOS technology

Author(s): P. De Moor, Paul Goetschalckx, Maarten Rosmeulen, Luc Haspeslagh, David San Segundo Bello, Pierre Boulenc, Steven Thijs, Stefano Guerrieri

Published in: 2018

Goals and directions of the newly started EXIST project

Author(s): Piet De Moor

Published in: 2015

TDI imaging using embedded CCD in CMOS technology: the optimal solution for low orbit earth observation

Author(s): Piet De Moor, Paul Goetschalckx, Jonathan Borremans, Maarten Rosmeulen, Luc Haspeslagh, Andy Lambrechts

Published in: 2016

CCD-in-CMOS Platform for Time Delay Integration

Author(s): David San Segundo Bello, Pierre Boulenc, Linkun Wu, Vasyl Motsnyi, Luc Haspeslagh, Stefano Guerrieri, Maarten Rosmeulen, Jonathan Borremans, Piet De Moor

Published in: 2018

Adimec_and_partners_awarded_two_projects_developing_next_generation_image_sensor_and_camera_technologies

Author(s): ADMIEC

Published in: Press Release, 2016

CCD-in-CMOS Time Delay Integration Imagers: the best of 2 worlds

Author(s): Piet De Moor

Published in: 2017

TDI Imaging Using CCD-in-CMOS Technology: An Optimal Solution for Earth Observation, Industrial Inspection and Life Sciences Applications

Author(s): Piet De Moor

Published in: 2017

Time Delay Integration CCD-in-CMOS platform development

Author(s): Pierre Boulenc, Linkun Wu, Vasyl Motsnyi, David San Segundo Bello, Luc Haspeslagh, Stefano Guerrieri, Maarten Rosmeulen, Jonathan Borremans, Piet De Moor

Published in: 2017

Multispectral time delay integration line scan imagers using CCD-in-CMOS technology

Author(s): Piet De Moor

Published in: 2018

New image sensor technologies for enhanced vision systems

Author(s): Piet De Moor

Published in: 2018

Multispectral Time Delay Integration imager using CCD-in-CMOS technology

Author(s): Piet De Moor et al

Published in: 2018

Peer reviewed articles (6)

Content-aware objective video quality assessment

Author(s): Benhur Ortiz-Jaramillo, Jorge Niño-Castañeda, Ljiljana Platiša, Wilfried Philips

Published in: Journal of Electronic Imaging, Issue 25/1, 2016, Page(s) 013011, ISSN 1017-9909

DOI: 10.1117/1.JEI.25.1.013011

Energy balance in Spectral Filter Array camera design

Author(s): Pierre-Jean Lapray, Jean-Baptiste Thomas, Pierre Gouton, Yassine Ruichek

Published in: Journal of the European Optical Society-Rapid Publications, Issue 13/1, 2017, ISSN 1990-2573

DOI: 10.1186/s41476-016-0031-7

Copper Oxide Direct Bonding of 200mm CMOS Wafers with Five Metal Levels and TSVs: Morphological and Electrical Characterization

Author(s): C. Cavaco, L. Peng, S. Lavizzari, J. Claes, N. V. Hoovels, S. Guerrieri, D. S. Tezcan, H. Osman

Published in: ECS Transactions, Issue 75/7, 2016, Page(s) 43-46, ISSN 1938-5862

DOI: 10.1149/07507.0043ecst

Image Denoising Using Quadtree-Based Nonlocal Means With Locally Adaptive Principal Component Analysis

Author(s): Chenglin Zuo, Ljubomir Jovanov, Bart Goossens, Hiep Quang Luong, Wilfried Philips, Yu Liu, Maojun Zhang

Published in: IEEE Signal Processing Letters, Issue 23/4, 2016, Page(s) 434-438, ISSN 1070-9908

DOI: 10.1109/LSP.2016.2530406

High Dynamic Range Spectral Imaging Pipeline For Multispectral Filter Array Cameras

Author(s): Pierre-Jean Lapray, Jean-Baptiste Thomas, Pierre Gouton

Published in: Sensors, Issue 17/6, 2017, Page(s) 1281, ISSN 1424-8220

DOI: 10.3390/s17061281

Multiview video quality enhancement

Author(s): Ljubomir Jovanov, Hiêp Luong, Wilfried Philips

Published in: Journal of Electronic Imaging, Issue 25/1, 2016, Page(s) 013031, ISSN 1017-9909

DOI: 10.1117/1.JEI.25.1.013031

Non-peer reviewed articles (1)

Paper No S8.3: Content Capture and View Interpolation Algorithm for Multiview Autostereoscopic Displays

Author(s): Ljubomir Jovanov, Hiep Luong, Wilfried Philips

Published in: SID Symposium Digest of Technical Papers, Issue 46/S1, 2015, Page(s) 35-35, ISSN 0097-966X

DOI: 10.1002/sdtp.10572

Project information

EXIST

Grant agreement ID: 662222

Project website

Status

Closed project

Start date

1 May 2015
End date

31 December 2018

Funded under:

H2020-EU.2.1.1.7.

Overall budget:

€ 26 802 872,75
EU contribution

€ 8 575 964,15

Coordinated by:

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

This project is featured in...

RESEARCH*EU MAGAZINE

How tech is taking on terrorism

Issue 87, November 2019

Project information

EXIST

Grant agreement ID: 662222

Project website

Status

Closed project

Start date

1 May 2015
End date

31 December 2018

Funded under:

H2020-EU.2.1.1.7.

Overall budget:

€ 26 802 872,75
EU contribution

€ 8 575 964,15

Coordinated by:

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Belgium

Project information

EXIST

Grant agreement ID: 662222

Project website

Status

Closed project

Start date

1 May 2015
End date

31 December 2018

Funded under:

H2020-EU.2.1.1.7.

Overall budget:

€ 26 802 872,75
EU contribution

€ 8 575 964,15

Coordinated by:

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

This project is featured in...

RESEARCH*EU MAGAZINE

How tech is taking on terrorism

Issue 87, November 2019

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Last update: 3 September 2019

Record number: 198017

Permalink: https://cordis.europa.eu/project/rcn/198017/en

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New sensors usher in next-generation vision systems in security, medicine and automotive applications

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Periodic Reporting for period 3 - EXIST (Extended Image Sensing Technologies)

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