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Assembly of miniaturized PCBs by using low cost hyper-fine solder powders

Assembly of miniaturized PCBs by using low cost hyper-fine solder powders

Objective

The total EU electronics industry employs ≈20.5 million people, sales exceeding €1 trillion and includes 396,000 SMEs. It is a major contributor to EU GDP and its size continues to grow fueled by demand from consumers to many industries. Despite its many positive impacts, the industry also faces some challenges connected with the enormous quantity of raw materials that it needs for sustainability, the huge quantity of Waste Electrical, Electronics Equipment (WEEE) generated and the threat of competition from Asia. To sustain its growth, to manage the impact of WEEE and to face the competition from Asia, the industry needs innovations in key areas. One such area is the drive for ultra-miniaturisation/ultlra-functionality of equipment. The key current road block/limitation to achieving the goal of ultra-miniaturisation/functionality is how to increase the component density on the printed circuit board (PCB). This is currently limited by the availability of hyper fine pitch solder powder pastes. FineSol aims to deliver at first stage an integrated production line for solder particles with size 1-10 μm and to formulate solder pastes containing these particles. Thus, by proper printing methods (e.g. screen and jet printing) the fabrication of PCBs with more than double component density will be achieved. Consequently, this would effectively enable more than a doubling of the functions available on electronic devices such as cell phones, satellite navigation systems, health devices etc. The successful completion of the FineSol project would lift the ultra-miniaturisation/functionality road block and also enable reduction in raw material usage, reduction in WEEE, reduction in pollution and associated health costs and also a major reduction in EU energy demand with all its indirect benefits for environment and society.

Coordinator

ETHNIKO KENTRO EREVNAS KAI TECHNOLOGIKIS ANAPTYXIS

Address

Charilaou Thermi Road 6 Km
57001 Thermi Thessaloniki

Greece

Activity type

Research Organisations

EU Contribution

€ 723 875

Participants (13)

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ATOMISING SYSTEMS LIMITED

United Kingdom

EU Contribution

€ 450 625

POLMECANIC Sp. z o.o.

Poland

EU Contribution

€ 265 475

CREATIVE NANO PC

Greece

EU Contribution

€ 196 700

ABIS SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA SPK

Poland

EU Contribution

€ 253 400

INSTITUTO DE SOLDADURA E QUALIDADE

Portugal

EU Contribution

€ 443 337,50

Prisma Electronics ABEE

Greece

EU Contribution

€ 242 375

MAT-TECH BV

Netherlands

EU Contribution

€ 415 065

EKTOS TESTING & RELIABILITY SERVICE AS

Denmark

EU Contribution

€ 440 410

CENTER FOR TECHNOLOGY RESEARCH ANDINNOVATION (CETRI) LTD

Cyprus

EU Contribution

€ 400 750

RISE RESEARCH INSTITUTES OF SWEDEN AB

Sweden

EU Contribution

€ 369 500

EUROPEAN FEDERATION FOR WELDING JOINING AND CUTTING

Belgium

EU Contribution

€ 207 562,50

APPLIED MATERIALS ITALIA SRL

Italy

EU Contribution

€ 217 000

MICROSEMI SEMICONDUCTOR LIMITED

United Kingdom

EU Contribution

€ 333 375

Project information

Grant agreement ID: 680718

Status

Closed project

  • Start date

    1 November 2015

  • End date

    30 April 2019

Funded under:

H2020-EU.2.1.5.1.

  • Overall budget:

    € 6 148 635

  • EU contribution

    € 4 959 450

Coordinated by:

ETHNIKO KENTRO EREVNAS KAI TECHNOLOGIKIS ANAPTYXIS

Greece