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Assembly of miniaturized PCBs by using low cost hyper-fine solder powders

Cel

The total EU electronics industry employs ≈20.5 million people, sales exceeding €1 trillion and includes 396,000 SMEs. It is a major contributor to EU GDP and its size continues to grow fueled by demand from consumers to many industries. Despite its many positive impacts, the industry also faces some challenges connected with the enormous quantity of raw materials that it needs for sustainability, the huge quantity of Waste Electrical, Electronics Equipment (WEEE) generated and the threat of competition from Asia. To sustain its growth, to manage the impact of WEEE and to face the competition from Asia, the industry needs innovations in key areas. One such area is the drive for ultra-miniaturisation/ultlra-functionality of equipment. The key current road block/limitation to achieving the goal of ultra-miniaturisation/functionality is how to increase the component density on the printed circuit board (PCB). This is currently limited by the availability of hyper fine pitch solder powder pastes. FineSol aims to deliver at first stage an integrated production line for solder particles with size 1-10 μm and to formulate solder pastes containing these particles. Thus, by proper printing methods (e.g. screen and jet printing) the fabrication of PCBs with more than double component density will be achieved. Consequently, this would effectively enable more than a doubling of the functions available on electronic devices such as cell phones, satellite navigation systems, health devices etc. The successful completion of the FineSol project would lift the ultra-miniaturisation/functionality road block and also enable reduction in raw material usage, reduction in WEEE, reduction in pollution and associated health costs and also a major reduction in EU energy demand with all its indirect benefits for environment and society.

Dziedzina nauki

  • /inżynieria i technologia/inżynieria elektryczna, inżynieria elektroniczna, inżynieria informatyczna/telekomunikacja/telefon komórkowy
  • /nauki społeczne/geografia społeczna i ekonomiczna/transport/systemy nawigacyjne
  • /nauki przyrodnicze/nauki fizyczne/fizyka teoretyczna/cząstki

Zaproszenie do składania wniosków

H2020-FoF-2015
Zobacz inne projekty w ramach tego zaproszenia

System finansowania

IA - Innovation action

Koordynator

ETHNIKO KENTRO EREVNAS KAI TECHNOLOGIKIS ANAPTYXIS
Adres
Charilaou Thermi Road 6 Km
57001 Thermi Thessaloniki
Greece
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Research Organisations
Wkład UE
€ 723 875

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ATOMISING SYSTEMS LIMITED
United Kingdom
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S95NF Sheffield
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POLMECANIC GROUP SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA
Polska
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Ul. Targowa 10C
98 346 Skomlin
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CREATIVE NANO PC
Greece
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€ 196 700
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Leventi 4
12132 Peristeri
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ABIS SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA SPK
Polska
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€ 253 400
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Ul. Kamienna 17
30 199 Rzaska
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INSTITUTO DE SOLDADURA E QUALIDADE
Portugalia
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2740 120 Porto Salvo
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€ 242 375
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Dimokratias Avenue 87
68100 Alexandroupolis
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Niderlandy
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5692 DM Son En Breugel
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EKTOS TESTING & RELIABILITY SERVICE AS
Dania
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2450 Kobenhavn
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1077 Nicosia
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501 15 Boras
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1120 Bruxelles
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APPLIED MATERIALS ITALIA SRL
Włochy
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United Kingdom
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NP26 5YW Gwent
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