Objectif DIMENSION establishes a truly integrated electro-optical platform, extending the silicon (Bi)CMOS and silicon photonics platform with III-V photonic functionality. The III-V integration concept is fully CMOS compatible and offers fundamental advantages compared to state-of-the art integration approaches. After bonding and growing ultra-thin III-V structures onto the silicon front-end-of-line, the active optical functions are embedded into the back-end of line stack. This offers great opportunities for new innovative devices and functions at the chip-level but also for the assembly of such silicon devices. As processing takes place on silicon wafers, this project has the unique opportunity to bring the cost of integrated devices, with CMOS, photonic and III-V functionality, down to the cost of silicon volume manufacturing. Such a platform has the potential to allow Europe to take a leading position in the field of high functionality integrated photonics. Moreover, the project demonstrators adhere to standards such as IEEE802.3 25G optical components and low-power electronics, thus opening a viable route towards ultra-low-cost high-performance optical transceivers for a new era of data centres and cloud systems. DIMENSION will realise three demonstrators:• A short-reach transmitter for intra-datacenter operation addressing the 400 GbE-LR8 (IEEE 802.3bs) standard making use of an array of directly modulated lasers, pulse-amplitude-modulation (PAM4) techniques and 8 wavelength channels in the telecom O-band.• A medium-reach transmitter for inter-datacenter applications beyond the 400 GbE-LR8 (IEEE 802.3bs) standard by providing a tuneable coherent transmitter for inter-datacenter and metro applications for link lengths in excess of 10km using a modulator integrated on the same chip.• A novel laser directly grown on silicon photonics, operated at 25Gb/s in the telecom O-band demonstrating the significant cost-saving potential of the technologies pursued in DIMENSION. Champ scientifique natural sciencescomputer and information sciencesdata sciencebig datanatural scienceschemical sciencesinorganic chemistrymetalloidsnatural sciencesphysical sciencesopticslaser physics Programme(s) H2020-EU.2.1.1. - INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT) Main Programme Thème(s) ICT-27-2015 - Photonics KET Appel à propositions H2020-ICT-2015 Voir d’autres projets de cet appel Régime de financement RIA - Research and Innovation action Coordinateur TECHNISCHE UNIVERSITAET DRESDEN Contribution nette de l'UE € 705 500,00 Adresse HELMHOLTZSTRASSE 10 01069 Dresden Allemagne Voir sur la carte Région Sachsen Dresden Dresden, Kreisfreie Stadt Type d’activité Higher or Secondary Education Establishments Liens Contacter l’organisation Opens in new window Site web Opens in new window Participation aux programmes de R&I de l'UE Opens in new window Réseau de collaboration HORIZON Opens in new window Coût total € 705 500,00 Participants (5) Trier par ordre alphabétique Trier par contribution nette de l'UE Tout développer Tout réduire IBM RESEARCH GMBH Suisse Contribution nette de l'UE € 0,00 Adresse SAEUMERSTRASSE 4 8803 Rueschlikon Voir sur la carte Région Schweiz/Suisse/Svizzera Zürich Zürich Type d’activité Private for-profit entities (excluding Higher or Secondary Education Establishments) Liens Contacter l’organisation Opens in new window Site web Opens in new window Participation aux programmes de R&I de l'UE Opens in new window Réseau de collaboration HORIZON Opens in new window Coût total € 800 370,00 ADTRAN NETWORKS SE Allemagne Contribution nette de l'UE € 522 500,00 Adresse MAERZENQUELLE 1-3 98617 Meiningen Voir sur la carte Région Thüringen Thüringen Schmalkalden-Meiningen Type d’activité Private for-profit entities (excluding Higher or Secondary Education Establishments) Liens Contacter l’organisation Opens in new window Site web Opens in new window Participation aux programmes de R&I de l'UE Opens in new window Réseau de collaboration HORIZON Opens in new window Coût total € 522 500,00 IHP GMBH - LEIBNIZ INSTITUTE FOR HIGH PERFORMANCE MICROELECTRONICS Allemagne Contribution nette de l'UE € 800 633,75 Adresse IM TECHNOLOGIEPARK 25 15236 Frankfurt Oder Voir sur la carte Région Brandenburg Brandenburg Oder-Spree Type d’activité Research Organisations Liens Contacter l’organisation Opens in new window Participation aux programmes de R&I de l'UE Opens in new window Réseau de collaboration HORIZON Opens in new window Coût total € 800 633,75 RESEARCH AND EDUCATION LABORATORY IN INFORMATION TECHNOLOGIES Participation terminée Grèce Contribution nette de l'UE € 270 625,00 Adresse Adrianiou 2 & Papada 11525 Athens Voir sur la carte Région Αττική Aττική Κεντρικός Τομέας Αθηνών Type d’activité Research Organisations Liens Contacter l’organisation Opens in new window Site web Opens in new window Participation aux programmes de R&I de l'UE Opens in new window Réseau de collaboration HORIZON Opens in new window Coût total € 270 625,00 ALTER TECHNOLOGY TUV NORD UK LIMITED Royaume-Uni Contribution nette de l'UE € 322 500,00 Adresse BAIN SQUARE 5 EH54 7DQ Livingston Voir sur la carte PME L’entreprise s’est définie comme une PME (petite et moyenne entreprise) au moment de la signature de la convention de subvention. Oui Région Scotland Eastern Scotland West Lothian Type d’activité Private for-profit entities (excluding Higher or Secondary Education Establishments) Liens Contacter l’organisation Opens in new window Participation aux programmes de R&I de l'UE Opens in new window Réseau de collaboration HORIZON Opens in new window Coût total € 322 500,00
