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High density scalable optically interconnected Tb/s Board

High density scalable optically interconnected Tb/s Board

Objective

Optical communications are becoming always more relevant because of the continuous growth of the requiested bandwidth. In the last decade we assisted a continuous growing of transport and metro netwotks, presently the bottleneck is in the processing of the huge amount of data constituted by the growing number of users, the capacity of the content that is exchanged and the convergence of Telecom and Datacom. This accumulation of data are elaborated and redirected within data centers with a continuous growing of traffic congestion. The continuous growth of traffic require therefore a roadmap of bandwidth density growth that necessarily has to be scalable on the timeframe of several years. To this point photonics plays a crucial role that is always more pervasive. However a major limiting factor is also arising from the energy cost and latency accumulated by the need of aggregation to route signals. To limitate this effect is necessary to make possible data exchange and processing without or with limited aggregation. Teraboard project consists in developing a full intra data center photonic platform for intraboard, intrarack and intra data center optical communications. The Teraboard interconnection platform will be based on ultra-high density and scalable bandwidth optical interconnectivity with low insertion loss and a target of lowest energy cost per channel of 2.5pJ/bit and a manufacturing cost of 0.1$/Gb/s in volumes. These target values are 10x reduction respect to commercial state of the art. Teraboard demonstrates: 1) passive, scalable, 3D inter processor interconnection layer, 2) novel WDM optical connector to plug the fiber ribbons directly onto the transceiver chip, 3) intraboard transceiver bank with high density bandwidth of 7Tb/s/cm2. Single wavelength laser arrays will be directly integrated on the silicon photonics transceiver circuits, 4) and edge single and four wavelength transceiver interface with bandwidth density of 50 and 7Tb/s/cm2 respectively.

Coordinator

CONSORZIO NAZIONALE INTERUNIVERSITARIO PER LE TELECOMUNICAZIONI

Address

Viale G. P. Usberti 181a
43124 Parma

Italy

Activity type

Higher or Secondary Education Establishments

EU Contribution

€ 1 029 750

Participants (9)

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ERICSSON TELECOMUNICAZIONI SPA

Italy

EU Contribution

€ 241 250

STMICROELECTRONICS SRL

Italy

EU Contribution

€ 370 350

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Belgium

EU Contribution

€ 1 955 357,50

IMINDS

Belgium

ALCATEL-LUCENT ITALIA S.P.A.

Italy

NOKIA SOLUTIONS AND NETWORKS ITALIA SPA

Italy

EU Contribution

€ 119 950

CONSIGLIO NAZIONALE DELLE RICERCHE

Italy

EU Contribution

€ 206 250

UNIVERSITAT POLITECNICA DE VALENCIA

Spain

EU Contribution

€ 270 000

EUROPEAN PHOTONICS INDUSTRY CONSORTIUM

France

EU Contribution

€ 56 250

Project information

Grant agreement ID: 688510

Status

Ongoing project

  • Start date

    1 December 2015

  • End date

    30 November 2019

Funded under:

H2020-EU.2.1.1.

  • Overall budget:

    € 4 249 157,50

  • EU contribution

    € 4 249 157,50

Coordinated by:

CONSORZIO NAZIONALE INTERUNIVERSITARIO PER LE TELECOMUNICAZIONI

Italy