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Wafer scale Integration of Photonics and Electronics

Objective

The WIPE project aims at developing hybrid electronic-photonic chips as a key enabling technology for data transmission purposes. It aims at bringing photonics to a new level by developing a concept that can be well industrialised. This sustains EU leadership in photonics, as is the ambition of the work program.

A new wafer-scale technology will thus be developed for direct and intimate attachment of III-V Indium-Phosphide (InP) photonic integrated circuits (PICs) and BiCMOS electronic chips (ICs). The ICs contain the driver, receiver andcontrol electronics for the PIC and enable direct connection to polymer optical waveguides. This technology of ‘wafer scale heterogeneous integration’ enables high-performance and high-density photonic-electronic (photronic) modules are created having a lower energy consumption, lower packaging complexity and lower cost compared to modules using more traditional interconnection techniques like wire bonding and laser welding of fibre connections.

Next to the new bonding technology, an integrated module design technology is developed for efficient co-design of hybrid photonic and electronic modules. A library consisting of photonic/electronic standard modules, is created leveraging the process design kits (PDKs) of the most important European foundries of photonic chips in combination with a powerful BiCMOS. These tools are of significantimportance to industry, since they offer photronic module designers a standardised approach that highly facilitates the module design for SMEs and affordable manufacturing by photonic and electronic foundries. The WIPE approach will be proven by showing the feasibility of a 400Gb/s transceiver for data centre application.

Call for proposal

H2020-ICT-2015
See other projects for this call

Coordinator

TECHNISCHE UNIVERSITEIT EINDHOVEN
Address
Groene Loper 3
5612 AE Eindhoven
Netherlands
Activity type
Higher or Secondary Education Establishments
EU contribution
€ 1 030 188,75

Participants (7)

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Belgium
EU contribution
€ 410 437,50
Address
Kapeldreef 75
3001 Leuven
Activity type
Research Organisations
EFFECT PHOTONICS LTD
United Kingdom
EU contribution
€ 193 562,50
Address
Prospect House, Sinderland Road 2
WA145ET Altrincham
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
IBM RESEARCH GMBH
Switzerland
EU contribution
€ 0
Address
Saeumerstrasse 4
8803 Rueschlikon
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
Germany
EU contribution
€ 601 147,50
Address
Hansastrasse 27C
80686 Munchen
Activity type
Research Organisations
SMART PHOTONICS BV
Netherlands
EU contribution
€ 216 505
Address
High Tech Campus 29
5656 AE Eindhoven
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
BERENSCHOT GROEP BV
Netherlands
EU contribution
€ 73 500
Address
Europalaan 40
3526 KS Utrecht
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)
EFFECT PHOTONICS BV
Netherlands
EU contribution
€ 537 656,25
Address
Torenallee 20
5617 BC Eindhoven
Activity type
Private for-profit entities (excluding Higher or Secondary Education Establishments)