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Wafer scale Integration of Photonics and Electronics

Wafer scale Integration of Photonics and Electronics

Objective

The WIPE project aims at developing hybrid electronic-photonic chips as a key enabling technology for data transmission purposes. It aims at bringing photonics to a new level by developing a concept that can be well industrialised. This sustains EU leadership in photonics, as is the ambition of the work program.

A new wafer-scale technology will thus be developed for direct and intimate attachment of III-V Indium-Phosphide (InP) photonic integrated circuits (PICs) and BiCMOS electronic chips (ICs). The ICs contain the driver, receiver andcontrol electronics for the PIC and enable direct connection to polymer optical waveguides. This technology of ‘wafer scale heterogeneous integration’ enables high-performance and high-density photonic-electronic (photronic) modules are created having a lower energy consumption, lower packaging complexity and lower cost compared to modules using more traditional interconnection techniques like wire bonding and laser welding of fibre connections.

Next to the new bonding technology, an integrated module design technology is developed for efficient co-design of hybrid photonic and electronic modules. A library consisting of photonic/electronic standard modules, is created leveraging the process design kits (PDKs) of the most important European foundries of photonic chips in combination with a powerful BiCMOS. These tools are of significantimportance to industry, since they offer photronic module designers a standardised approach that highly facilitates the module design for SMEs and affordable manufacturing by photonic and electronic foundries. The WIPE approach will be proven by showing the feasibility of a 400Gb/s transceiver for data centre application.
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Coordinator

TECHNISCHE UNIVERSITEIT EINDHOVEN

Address

Groene Loper 3
5612 Ae Eindhoven

Netherlands

Activity type

Higher or Secondary Education Establishments

EU Contribution

€ 1 030 188,75

Participants (8)

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INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Belgium

EU Contribution

€ 410 437,50

IMINDS

Belgium

EFFECT PHOTONICS LTD

United Kingdom

EU Contribution

€ 193 562,50

IBM RESEARCH GMBH

Switzerland

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Germany

EU Contribution

€ 601 147,50

SMART PHOTONICS BV

Netherlands

EU Contribution

€ 216 505

BERENSCHOT GROEP BV

Netherlands

EU Contribution

€ 73 500

EFFECT PHOTONICS BV

Netherlands

EU Contribution

€ 537 656,25

Project information

Grant agreement ID: 688572

Status

Ongoing project

  • Start date

    1 January 2016

  • End date

    30 June 2019

Funded under:

H2020-EU.2.1.1.

  • Overall budget:

    € 3 766 097,50

  • EU contribution

    € 3 062 997,50

Coordinated by:

TECHNISCHE UNIVERSITEIT EINDHOVEN

Netherlands