Objectif HIOS (“Highly Integrated Optoelectronic Sensor”) aims to develop and to launch world’s first light sensor with fully integrated optical stack. The fully integrated optically stack technology which will be developed in HIOS project will be the technology enabler which brings the highly integrated optoelectronic sensor to the market. The sensors which will be enabled in the first step are single band and multi band light sensors, namely Ambient Light Sensor and derivate such as UV Sensor & Color Sensor. Three main markets which will be addressed are the Wearable, Low Cost Consumer (smart phones, cellular) & Smart Lighting Market.ams already offers prior art TSL2584TSV which is industry’s first ambient light sensor with 3D/TSV and single filter integrated at wafer level. In HIOS project the consortium wants to move one step further to ensure also the future competitiveness and keep the market leadership in Europe. HIOS project wants to integrate the full optical stacks including multiple filters, lenses and apertures for the first time and wants to provide a high volume production environment for 3D/TSV + Filters + Wafer Level Package. The main technical innovations will be Filter tool and processes developed to achieve industry’s tightest filter specifications, Wafer Level Molding tool modified by adding new alignment system to achieve, novel patented lense design and wafer level mold process, filters, lenses and apertures integrated at Wafer Level for the first time and industry’s lowest alignment tolerances as required by the applications. The expected outcomes are a Single band and multi-band light sensors – smallest size and lowest system cost at best optical performance (ambient light sensor and derivatives such as color sensor and UV sensor) and an Equipment which enabling this new application and many other applications; WLM- tightest overlay control; Filter – tightest pass band width control; low stress filter deposition to enable multiple filters. Champ scientifique natural sciencesphysical scienceselectromagnetism and electronicsoptoelectronicsengineering and technologymaterials engineeringcolorsengineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensorsoptical sensorsengineering and technologymaterials engineeringcoating and filmsengineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringcontrol systemshome automation Programme(s) H2020-EC - Horizon 2020 Framework Programme Main Programme H2020-EU.3. - PRIORITY 'Societal challenges H2020-EU.2. - PRIORITY 'Industrial leadership' Thème(s) FTIPilot-1-2015 - Fast Track to Innovation Pilot Appel à propositions H2020-FTIPilot-2015-1 Voir d’autres projets de cet appel Régime de financement IA - Innovation action Coordinateur AMS-OSRAM AG Contribution nette de l'UE € 1 471 341,38 Adresse TOBELBADERSTRASSE 30 SCHLOSS PREMSTATTEN 8141 UNTERPREMSTATTEN Autriche Voir sur la carte Région Südösterreich Steiermark Graz Type d’activité Private for-profit entities (excluding Higher or Secondary Education Establishments) Liens Contacter l’organisation Opens in new window Site web Opens in new window Participation aux programmes de R&I de l'UE Opens in new window Réseau de collaboration HORIZON Opens in new window Coût total € 2 101 916,25 Participants (3) Trier par ordre alphabétique Trier par contribution nette de l'UE Tout développer Tout réduire BUHLER ALZENAU GMBH Allemagne Contribution nette de l'UE € 770 000,00 Adresse SIEMENSSTRASSE 88 63755 ALZENAU Voir sur la carte Région Bayern Unterfranken Aschaffenburg, Landkreis Type d’activité Private for-profit entities (excluding Higher or Secondary Education Establishments) Liens Contacter l’organisation Opens in new window Participation aux programmes de R&I de l'UE Opens in new window Réseau de collaboration HORIZON Opens in new window Coût total € 1 100 000,00 BOSCHMAN TECHNOLOGIES BV Pays-Bas Contribution nette de l'UE € 489 825,00 Adresse STENOGRAAF 3 6921 EX Duiven Voir sur la carte PME L’entreprise s’est définie comme une PME (petite et moyenne entreprise) au moment de la signature de la convention de subvention. Oui Région Oost-Nederland Gelderland Arnhem/Nijmegen Type d’activité Private for-profit entities (excluding Higher or Secondary Education Establishments) Liens Contacter l’organisation Opens in new window Site web Opens in new window Participation aux programmes de R&I de l'UE Opens in new window Réseau de collaboration HORIZON Opens in new window Coût total € 699 750,00 ADVANCED PACKAGING CENTER BV Pays-Bas Contribution nette de l'UE € 266 612,50 Adresse STENOGRAAF 3 6921 EX Duiven Voir sur la carte PME L’entreprise s’est définie comme une PME (petite et moyenne entreprise) au moment de la signature de la convention de subvention. Oui Région Oost-Nederland Gelderland Arnhem/Nijmegen Type d’activité Private for-profit entities (excluding Higher or Secondary Education Establishments) Liens Contacter l’organisation Opens in new window Site web Opens in new window Participation aux programmes de R&I de l'UE Opens in new window Réseau de collaboration HORIZON Opens in new window Coût total € 380 875,00