Objective
HIPERLAM is an SME driven Research and Innovation Action (RIA) well-aligned to the Factories of the Future (FoF) Initiative with a strong emphasis upon demonstrating superior cost and speed performance in end-to-end processes featuring laser-based additive manufacturing in two key applications requiring high resolution printed conductive metallic lines, namely laser printed RFID antenna and laser printed Fingerprint sensors. Existing subtractive top-down process will be replaced by HIPERLAM’s additive process for both Applications. Process maps illustrate the existing multiple processing steps compared to HIPERLAM’s significantly fewer steps. Real-time diagnostics are included and Modelling investigations will be undertaken to support optimisation. The promise of HIPERLAM’s high resolution laser based additive manufacturing solutions is to transform the manufacturing processing speed by 10x for laser printed RFID antenna (Application 1) and 5x in the case of the lead-time for laser printed fingerprint sensor design (Application 2). Similarly, HIPERLAM promises to reduce costs by 20x and 50% respectively for Application 1 and Application 2. HIPERLAM features high resolution LIFT Printing and Laser Sintering utilising novel high viscous inks to achieve printed conductive metallic structures down to 10 µm resolution over large areas (10 to 1000 cm2) suitable for scale-up to full production. The targeted applications address global market needs and will support mainstream adoption of AM processes in EU industry by displacing existing processes with smart, flexible, digitally enabled manufacturing technology. HIPERLAM business cases promise significant revenue growth in both application spaces and in the potential for consortium partners to establish themselves in pre-eminent positions in high resolution, low cost, high throughput AM technology.
Fields of science
- engineering and technologymaterials engineering
- engineering and technologyelectrical engineering, electronic engineering, information engineeringelectronic engineeringsensors
- engineering and technologymechanical engineeringmanufacturing engineeringadditive manufacturing
- natural sciencesphysical sciencesopticslaser physics
Programme(s)
Funding Scheme
RIA - Research and Innovation actionCoordinator
81101 Yavne
Israel
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Participants (8)
157 80 Athina
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2595 DA Den Haag
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OX11 7HP Didcot
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
2310102 Migdal Haemek
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
CB4 0FX Cambridge
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TS21 3FG Cleveland
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
Participation ended
HD1 3BD Huddersfield
The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.
EH3 7PE Edinburgh
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The organization defined itself as SME (small and medium-sized enterprise) at the time the Grant Agreement was signed.