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Photonic Integrated Circuits Assembly and Packaging Pilot Line

Objective

PIXAPP will establish the world’s first open access Photonic Integrated Circuit (PIC) assembly & packaging Pilot Line. It combines a highly-interdisciplinary team of Europe’s leading industrial & research organisations. PIXAPP provides Europe’s SMEs with a unique one-stop-shop, enabling them to exploit the breakthrough advantages of PIC technologies. PIXAPP bridges the ‘valley of death’, providing SMEs with an easy access route to take R&D results from lab to market, giving them a competitive advantage over global competition. Target markets include communications, healthcare & security, which are of great socio-economic importance to Europe. PIXAPP’s manufacturing capabilities can support over 120 users per year, across all stages of manufacturing, from prototyping to medium scale manufacture. PIXAPP bridges missing gaps in the value chain, from assembly & packaging, through to equipment optimisation, test and application demonstration. To achieve these ambitious objectives, PIXAPP will; 1) Combine a group of Europe’s leading industrial & research organisations in an advanced PIC assembly & packaging Pilot Line facility.2) Develop an innovative Pilot Line operational model that coordinates activities between consortium partners & supports easy user access through a single entry point. 3) Establish packaging standards that provide cost-efficient assembly & packaging solutions, enabling transfer to full-scale industrial manufacture. 4) Create the highly-skilled workforce required to manage & operate these industrial manufacturing facilities.5) Develop a business plan to ensure Pilot Line sustainability & a route to industrial manufacturing.
PIXAPP will deliver significant impacts to a wide stakeholder group, highlighting how industrial & research sectors can collaborate to address emerging socio-economic challenges.
Leaflet | Map data © OpenStreetMap contributors, Credit: EC-GISCO, © EuroGeographics for the administrative boundaries

Coordinator

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK

Address

Western Road
T12 Yn60 Cork

Ireland

Activity type

Higher or Secondary Education Establishments

EU Contribution

€ 2 750 112,50

Participants (19)

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ARGOTECH AS

Czechia

EU Contribution

€ 879 943,75

EUROPEAN PHOTONICS INDUSTRY CONSORTIUM

France

EU Contribution

€ 488 250

MICROFLUIDIC CHIPSHOP GMBH

Germany

EU Contribution

€ 401 625

EBLANA PHOTONICS LIMITED

Ireland

EU Contribution

€ 300 125

FICONTEC SERVICE GMBH

Germany

EU Contribution

€ 787 718,75

FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Germany

EU Contribution

€ 848 892,50

INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM

Belgium

EU Contribution

€ 1 576 090

Linkra S.R.L.

Italy

PHOENIX BV

Netherlands

EU Contribution

€ 507 798,38

TECHNISCHE UNIVERSITEIT EINDHOVEN

Netherlands

EU Contribution

€ 526 690

TECHNOBIS IPPS BV

Netherlands

EU Contribution

€ 500 985,63

Teknologian tutkimuskeskus VTT Oy

Finland

EU Contribution

€ 651 151,25

LIONIX INTERNATIONAL BV

Netherlands

EU Contribution

€ 645 750

XIO PHOTONICS BV

Netherlands

Randox Laboratories Ltd

United Kingdom

EU Contribution

€ 93 187,50

KARLSRUHER INSTITUT FUER TECHNOLOGIE

Germany

EU Contribution

€ 572 250

III-V LAB

France

EU Contribution

€ 316 161,25

COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

France

EU Contribution

€ 629 206,25

CORDON ELECTRONICS ITALIA SRL

Italy

EU Contribution

€ 931 875

Project information

Grant agreement ID: 731954

Status

Ongoing project

  • Start date

    1 January 2017

  • End date

    31 December 2020

Funded under:

H2020-EU.2.1.1.

  • Overall budget:

    € 15 707 171,43

  • EU contribution

    € 13 407 812,76

Coordinated by:

UNIVERSITY COLLEGE CORK - NATIONAL UNIVERSITY OF IRELAND, CORK

Ireland