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Platform for Open Development of Systems of Artificial Intelligence

Platform for Open Development of Systems of Artificial Intelligence

Objective

The Bonseyes project aims to develop a platform consisting of a Data Marketplace, Deep Learning Toolbox, and Developer Reference Platforms for organizations wanting to adopt Artificial Intelligence in low power IoT devices (“edge computing”), embedded computing systems, or data center servers (“cloud computing”). It will bring about orders of magnitude improvements in efficiency, performance, reliability, security, and productivity in the design and programming of Systems of Artificial Intelligence that incorporate Smart Cyber Physical Systems while solving a chicken-egg problem for organizations who lack access to Data and Models. It’s open software architecture will facilitate adoption of the whole concept on a wider scale.

It aims to address one of the most significant trends in the Internet of Things which is the shifting balance between edge computing and cloud computing. The early days of the IoT have been characterized by the critical role of cloud platforms as application enablers. Intelligent systems have largely relied on the cloud level for their intelligence, and the actual devices of which they consist have been relatively unsophisticated. This old premise is currently being shaken up, as the computing capabilities on the edge level advance faster than those of the cloud level. This paradigm shift—from the connected device paradigm to the intelligent device paradigm opens up numerous opportunities.

To evaluate the effectiveness, technical feasibility, and to quantify the real-world improvements in efficiency, security, performance, effort and cost of adding AI to products and services using the Bonseyes platform, four complementary demonstrators will be built: Automotive Intelligent Safety, Automotive Cognitive Computing, Consumer Emotional Virtual Agent, and Healthcare Patient Monitoring. Bonseyes platform capabilities are aimed at being aligned with the European FI-PPP activities and take advantage of its flagship project FIWARE.
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Coordinator

NVISO SA

Address

Parc Scientifique Epfl
1015 Lausanne

Switzerland

Activity type

Other

Participants (13)

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UNIVERSIDAD DE CASTILLA - LA MANCHA

Spain

EU Contribution

€ 296 250

THE PROVOST, FELLOWS, FOUNDATION SCHOLARS & THE OTHER MEMBERS OF BOARD OF THE COLLEGE OF THE HOLY & UNDIVIDED TRINITY OF QUEEN ELIZABETH NEAR DUBLIN

Ireland

EU Contribution

€ 608 800

THE UNIVERSITY OF EDINBURGH

United Kingdom

EU Contribution

€ 680 876,25

FACHHOCHSCHULE NORDWESTSCHWEIZ

Switzerland

KLINIKUM RECHTS DER ISAR DER TECHNISCHEN UNIVERSITAT MUNCHEN

Germany

EU Contribution

€ 310 125

INSTITUTE OF COMMUNICATION AND COMPUTER SYSTEMS

Greece

EU Contribution

€ 404 250

SYNYO GmbH

Austria

EU Contribution

€ 280 808,75

HAUTE ECOLE SPECIALISEE DE SUISSE OCCIDENTALE

Switzerland

ARM LIMITED

United Kingdom

EU Contribution

€ 815 000

ZF FRIEDRICHSHAFEN AG

Germany

EU Contribution

€ 365 625

ISTRAZIVACKO-RAZVOJNI INSTITUT RT-RK DOO ZA SISTEME ZASNOVANE NA RACUNARIMA NOVI SAD

Serbia

EU Contribution

€ 862 500

SCIPROM SARL

Switzerland

BLEKINGE TEKNISKA HOGSKOLA

Sweden

EU Contribution

€ 393 790

Project information

Grant agreement ID: 732204

Status

Ongoing project

  • Start date

    1 December 2016

  • End date

    30 November 2019

Funded under:

H2020-EU.2.1.1.

  • Overall budget:

    € 8 593 952,50

  • EU contribution

    € 5 018 025

Coordinated by:

NVISO SA

Switzerland